Wakayama; Yoji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakayama; Yoji.The latest application filed is for "film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device".

Company Profile

0.8.8

Wakayama; Yoji - Tokyo N/A JP
Wakayama; Yoji - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive sheet Grant 9,878,520 - Ohashi , et al. January 30, 2	2018-01-30
Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device Grant 9,296,925 - Wakayama , et al. March 29, 2	2016-03-29
Film-Like Adhesive, Adhesive Sheet for Semiconductor Junction, and Method for Producing Semiconductor Device App 20150225613 - Wakayama; Yoji ; et al.	2015-08-13
Resin film forming sheet for chip, and method for manufacturing semiconductor chip Grant 8,735,881 - Shinoda , et al. May 27, 2	2014-05-27
Resin Film Forming Sheet For Chip, And Method For Manufacturing Semiconductor Chip App 20140141570 - Shinoda; Tomonori ; et al.	2014-05-22
Resin film forming sheet for chip, and method for manufacturing semiconductor chip Grant 8,674,349 - Shinoda , et al. March 18, 2	2014-03-18
Resin Film Forming Sheet for Chip, and Method for Manufacturing Semiconductor Chip App 20130011998 - Shinoda; Tomonori ; et al.	2013-01-10
Laser dicing sheet and manufacturing method for chip body Grant 8,174,130 - Sato , et al. May 8, 2	2012-05-08
Laser dicing sheet and process for producing chip body Grant 8,114,520 - Wakayama , et al. February 14, 2	2012-02-14
Adhesive Sheet App 20110045290 - Maeda; Jun ; et al.	2011-02-24
Laser Dicing Sheet and Manufacturing Method For Chip Body App 20090261084 - Wakayama; Yoji ; et al.	2009-10-22
Adhesive Sheet App 20080220253 - Ohashi; Hitoshi ; et al.	2008-09-11
Laser Dicing Sheet And Process For Producing Chip Body App 20080190904 - WAKAYAMA; Yoji ; et al.	2008-08-14
Laser Dicing Sheet And Manufacturing Method For Chip Body App 20080132034 - SATO; Yosuke ; et al.	2008-06-05

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