Wakashima; Yoshiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakashima; Yoshiaki.The latest application filed is for "substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package".

Company Profile

0.15.1

Wakashima; Yoshiaki - Kawasaki JP
Wakashima, Yoshiaki - Kawasaki-shi JP
Wakashima; Yoshiaki - Hosoyama Tama-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package Grant 6,708,398 - Wakashima , et al. March 23, 2	2004-03-23
Semiconductor device and method of fabrication thereof Grant 6,492,203 - Wakashima , et al. December 10, 2	2002-12-10
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package App 20020020909 - Wakashima, Yoshiaki ; et al.	2002-02-21
Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device Grant 6,268,648 - Fukutomi , et al. July 31, 2	2001-07-31
Semiconductor memory module having double-sided stacked memory chip layout Grant 5,910,685 - Watanabe , et al. June 8, 1	1999-06-08
Stacked semiconductor memory device and semiconductor memory module containing the same Grant 5,334,875 - Sugano , et al. * August 2, 1	1994-08-02
Semiconductor stacked device Grant 5,198,888 - Sugano , et al. * March 30, 1	1993-03-30
Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices Grant 5,028,986 - Sugano , et al. July 2, 1	1991-07-02
Semiconductor integrated circuit device and method of manufacturing the same Grant 4,982,265 - Watanabe , et al. January 1, 1	1991-01-01
Semiconductor device and tape carrier Grant 4,977,441 - Ohtani , et al. December 11, 1	1990-12-11
Semiconductor device and process for producing the same, and tape carrier used in said process Grant 4,792,532 - Ohtani , et al. December 20, 1	1988-12-20
Method of fabricating a resin mold type semiconductor device Grant 4,523,371 - Wakashima June 18, 1	1985-06-18
Semiconductor memories with .alpha. shield Grant 4,494,217 - Suzuki , et al. January 15, 1	1985-01-15
Method of making a semiconductor device Grant 4,064,289 - Yokoyama , et al. December 20, 1	1977-12-20
Semiconductor device Grant 3,946,427 - Iwasawa , et al. March 23, 1	1976-03-23
Method of manufacturing semiconductor device and resulting product Grant 3,939,488 - Wakashima , et al. February 17, 1	1976-02-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.