Wakao; Miyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakao; Miyuki.The latest application filed is for "silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same".

Company Profile

1.18.15

Wakao; Miyuki - Gunma JP
Wakao; Miyuki - Annaka JP
WAKAO; Miyuki - Annaka-shi JP
Wakao; Miyuki - Takasaki JP
Wakao; Miyuki - Takasaki-shi JP
Wakao; Miyuki - Gunma-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof Grant 10,308,803 - Shiobara , et al.	2019-06-04
Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same Grant 9,963,542 - Shiobara , et al. May 8, 2	2018-05-08
Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof Grant 9,944,760 - Shiobara , et al. April 17, 2	2018-04-17
Silicone-modified epoxy resin and composition and cured article thereof Grant 9,777,107 - Shiobara , et al. October 3, 2	2017-10-03
Addition-curable silicone resin composition and die attach material for optical semiconductor device Grant 9,660,157 - Yamazaki , et al. May 23, 2	2017-05-23
Silicone-modified Epoxy Resin, Composition Containing The Epoxy Resin, And Cured Product Of Same App 20170107322 - Shiobara; Toshio ; et al.	2017-04-20
Silicone-modified Epoxy Resin, Composition Containing Said Epoxy Resin, And Cured Product Thereof App 20170073457 - Shiobara; Toshio ; et al.	2017-03-16
Addition-curable Silicone Resin Composition And Die Attach Material For Optical Semiconductor Device App 20160251482 - YAMAZAKI; Tatsuya ; et al.	2016-09-01
Silicone-modified Epoxy Resin And Composition And Cured Article Thereof App 20160237202 - Shiobara; Toshio ; et al.	2016-08-18
Epoxy Resin Containing Silicone-Modified Epoxy Resin and Polyvalent Carboxylic Acid Compound, and Cured Product Thereof App 20160177085 - Shiobara; Toshio ; et al.	2016-06-23
Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device Grant 9,147,818 - Shiobara , et al. September 29, 2	2015-09-29
Epoxy composition for encapsulating an optical semiconductor element Grant 8,710,158 - Ueno , et al. April 29, 2	2014-04-29
Wavelength Conversion Sheet Filled With Large Amount Of Phosphor, Method Of Producing Light Emitting Semiconductor Device Using The Sheet, And Light Emitting Semiconductor Device App 20130113008 - SHIOBARA; Toshio ; et al.	2013-05-09
Method Of Producing Cured Thin Film Using Photocurable Silicone Resin Composition App 20130072592 - INAFUKU; Kenichi ; et al.	2013-03-21
Method For Curing A Silicone Resin Composition App 20120142803 - INAFUKU; Kenichi ; et al.	2012-06-07
Resin composition for encapsulating optical semiconductor element Grant 8,133,957 - Hamamoto , et al. March 13, 2	2012-03-13
Epoxy Composition For Encapsulating An Optical Semiconductor Element App 20110251305 - Ueno; Manabu ; et al.	2011-10-13
Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same Grant 7,985,806 - Shiobara , et al. July 26, 2	2011-07-26
Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device Grant 7,910,638 - Tada , et al. March 22, 2	2011-03-22
Resin Composition For Encapsulating Optical Semiconductor Element App 20100029887 - Hamamoto; Yoshihira ; et al.	2010-02-04
Diglycidylisocyanuryl-modified Organopolysiloxane And Composition Containing The Same App 20090203822 - SHIOBARA; Toshio ; et al.	2009-08-13
Semiconductor-encapsulating Epoxy Resin Composition, Preparation Method, And Semiconductor Device App 20090192258 - Tada; Tomoyoshi ; et al.	2009-07-30
Optical device-related adhesive and optical device Grant 6,709,756 - Kuwabara , et al. March 23, 2	2004-03-23
Epoxy resin composition, laminate film using the same, and semiconductor device Grant 6,512,031 - Honda , et al. January 28, 2	2003-01-28
Optical device-related adhesive and optical device App 20030010962 - Kuwabara, Haruyoshi ; et al.	2003-01-16
Epoxy resin composition Grant 6,506,822 - Ichiroku , et al. January 14, 2	2003-01-14
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device Grant 6,376,923 - Sumita , et al. April 23, 2	2002-04-23
Epoxy resin composition App 20020022681 - Ichiroku, Nobuhiro ; et al.	2002-02-21
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device Grant 6,294,271 - Sumita , et al. September 25, 2	2001-09-25
Flip-chip type semiconductor device Grant 6,225,704 - Sumita , et al. May 1, 2	2001-05-01
Organic silicon compounds Grant 5,336,786 - Shiobara , et al. August 9, 1	1994-08-09

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