Wakano; Motoki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wakano; Motoki.The latest application filed is for "metal particle and method for producing the same, covered metal particle, and metal powder".
- Wakano; Motoki - Suita JP
- WAKANO; Motoki - Suita-shi Osaka
- Wakano; Motoki - Yasugi N/A JP
- Wakano; Motoki - Yasugi-shi JP
| Patent | Date |
|---|---|
| Metal particle and method for producing the same, covered metal particle, and metal powder Grant 10,384,314 - Wakano A | 2019-08-20 |
| Metal Particle And Method For Producing The Same, Covered Metal Particle, And Metal Powder App 20180056451 - WAKANO; Motoki | 2018-03-01 |
| Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips Grant 8,368,195 - Tanie , et al. February 5, 2 | 2013-02-05 |
| Semiconductor device Grant 8,053,908 - Tanie , et al. November 8, 2 | 2011-11-08 |
| Solder alloy and glass bonded body using the same Grant 7,901,782 - Chiwata , et al. March 8, 2 | 2011-03-08 |
| Semiconductor Device App 20100193936 - TANIE; Hisashi ; et al. | 2010-08-05 |
| Semiconductor Device And Method For Manufacturing The Same App 20100171209 - Tanie; Hisashi ; et al. | 2010-07-08 |
| Solder Alloy And Glass Bonded Body Using The Same App 20080241552 - CHIWATA; Nobuhiko ; et al. | 2008-10-02 |
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