Wakamiya; Wataru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakamiya; Wataru.The latest application filed is for "stacked type capacitor having a dielectric film formed on a rough surface of an electrode and method of manufacturing thereof".

Company Profile

0.12.0

Wakamiya; Wataru - Hyogo JP
Wakamiya; Wataru - Amagasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked type capacitor having a dielectric film formed on a rough surface of an electrode and method of manufacturing thereof Grant 5,290,729 - Hayashide , et al. March 1, 1	1994-03-01
Semiconductor device having bonding pad comprising buffer layer Grant 5,288,661 - Satoh , et al. February 22, 1	1994-02-22
Complementary semiconductor device having improved device isolating region Grant 5,181,094 - Eimori , et al. January 19, 1	1993-01-19
CMOS semiconductor device with an element isolating field shield Grant 5,164,803 - Ozaki , et al. November 17, 1	1992-11-17
Semiconductor memory device with improved stacked capacitor structure Grant 5,101,251 - Wakamiya , et al. March 31, 1	1992-03-31
Semiconductor device having field shield isolation Grant 5,067,000 - Eimori , et al. November 19, 1	1991-11-19
Stacked capacitor for semiconductor memory device Grant 5,047,817 - Wakamiya , et al. September 10, 1	1991-09-10
LDD MOS device having an element separation region having an electrostatic screening electrode Grant 4,998,161 - Kimura , et al. March 5, 1	1991-03-05
Field effect transistor substantially coplanar surface structure Grant 4,994,893 - Ozaki , et al. February 19, 1	1991-02-19
Semiconductor device having a plurality of conductive layers and manufacturing method therefor Grant 4,984,055 - Okumura , et al. January 8, 1	1991-01-08
Semiconductor device having an isolation oxide film Grant 4,956,692 - Ozaki , et al. September 11, 1	1990-09-11
Process for preparing multilayer interconnection Grant 4,381,595 - Denda , et al. May 3, 1	1983-05-03

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