Wakamatsu; Yoshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakamatsu; Yoshihiro.The latest application filed is for "powder and granular material crushing and sizing apparatus".

Company Profile

0.5.5

Wakamatsu; Yoshihiro - Hokkaido JP
Wakamatsu; Yoshihiro - Sapporo JP
Wakamatsu; Yoshihiro - Ohta-ku JP
Wakamatsu; Yoshihiro - Tokyo JP
Wakamatsu, Yoshihiro - Ota-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Powder and granular material crushing and sizing apparatus Grant 8,336,797 - Wakamatsu , et al. December 25, 2	2012-12-25
Powder based granules disintegrating and sizing device, and powder based granules disintegrating and sizing method Grant 8,146,847 - Wakamatsu , et al. April 3, 2	2012-04-03
Powder based granules disintegrating and sizing device Grant 7,992,813 - Wakamatsu , et al. August 9, 2	2011-08-09
Powder and granular material crushing and sizing apparatus App 20110062264 - Wakamatsu; Yoshihiro ; et al.	2011-03-17
Powder Based Granules Disintegrating and Sizing Device, and Powder Based Granules Disintegrating and Sizing Method App 20090108112 - Wakamatsu; Yoshihiro ; et al.	2009-04-30
Powder Based Granules Disintegrating And Sizing Device App 20090026297 - Wakamatsu; Yoshihiro ; et al.	2009-01-29
Powder particle disintegrating and sizing apparatus Grant 7,455,252 - Nara , et al. November 25, 2	2008-11-25
Powder particle disintegrating and sizing apparatus App 20060124788 - Nara; Yorioki ; et al.	2006-06-15
Device for treating powder particles by rotary flow Grant 6,892,475 - Wakamatsu , et al. May 17, 2	2005-05-17
Device for treating powder particles by rotary flow App 20040168342 - Wakamatsu, Yoshihiro ; et al.	2004-09-02

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