Wakamatsu; Kosuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wakamatsu; Kosuke.The latest application filed is for "liquid ejecting head and liquid ejecting apparatus".

Company Profile

0.5.7

Wakamatsu; Kosuke - Chino JP
Wakamatsu; Kosuke - Chino-shi JP
Wakamatsu; Kosuke - Suwa-shi JP
Wakamatsu; Kosuke - Fujimi JP
Wakamatsu; Kosuke - Nagano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nozzle plate, liquid ejecting head, and liquid ejecting apparatus Grant 9,327,500 - Nagatoya , et al. May 3, 2	2016-05-03
Liquid ejecting head and liquid ejecting apparatus Grant 8,936,355 - Wakamatsu , et al. January 20, 2	2015-01-20
Nozzle Plate, Liquid Ejecting Head, And Liquid Ejecting Apparatus App 20140183284 - Nagatoya; Satoshi ; et al.	2014-07-03
Liquid Ejecting Head And Liquid Ejecting Apparatus App 20140184705 - Wakamatsu; Kosuke ; et al.	2014-07-03
Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge device Grant 8,128,202 - Matsuo , et al. March 6, 2	2012-03-06
Droplet ejection head and droplet ejection apparatus Grant 8,029,110 - Matsuo , et al. October 4, 2	2011-10-04
Droplet ejection head and droplet ejection apparatus Grant 8,029,111 - Matsuo , et al. October 4, 2	2011-10-04
Base Member Including Bonding Film, Bonding Method And Bonded Body App 20100323192 - Matsuo; Yasuhide ; et al.	2010-12-23
Base Member Including Bonding Film, Bonding Method And Bonded Body App 20100323193 - Matsuo; Yasuhide ; et al.	2010-12-23
Bonded Body And Bonding Method App 20100151231 - Matsuo; Yasuhide ; et al.	2010-06-17
Droplet Ejection Head And Droplet Ejection Apparatus App 20090115818 - MATSUO; Yasuhide ; et al.	2009-05-07
Droplet Ejection Head And Droplet Ejection Apparatus App 20090115823 - MATSUO; Yasuhide ; et al.	2009-05-07

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