Wakamatsu; Aiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wakamatsu; Aiko.The latest application filed is for "soldering assembly for detachable tip".
- Wakamatsu; Aiko - Osaka JP
| Patent | Date |
|---|---|
| Soldering assembly for detachable tip Grant 9,168,605 - Miyazaki , et al. October 27, 2 | 2015-10-27 |
| Desoldering tool Grant D740,091 - Mochizuki , et al. October 6, 2 | 2015-10-06 |
| Soldering Assembly for Detachable Tip App 20130270324 - Miyazaki; Mitsuhiko ; et al. | 2013-10-17 |
| Grip for hot air blowing tool for melting solder Grant D659,496 - Mochizuki , et al. May 15, 2 | 2012-05-15 |
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