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Patent applications and USPTO patent grants for WAKABAYASHI; Taishi.The latest application filed is for "method for manufacturing bonded soi wafer and bonded soi wafer".
Patent | Date |
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Method For Manufacturing Bonded Soi Wafer And Bonded Soi Wafer App 20210249301 - IMAI; Toshikazu ;   et al. | 2021-08-12 |
Heat treatment method for semiconductor wafer Grant 10,763,127 - Wakabayashi , et al. Sep | 2020-09-01 |
Method for manufacturing bonded SOI wafer Grant 10,566,196 - Kobayashi , et al. Feb | 2020-02-18 |
Method for manufacturing a bonded SOI wafer and bonded SOI wafer Grant 10,529,615 - Meguro , et al. J | 2020-01-07 |
Method for manufacturing a bonded SOI wafer Grant 10,460,983 - Wakabayashi , et al. Oc | 2019-10-29 |
Heat Treatment Method For Semiconductor Wafer App 20190035639 - WAKABAYASHI; Taishi ;   et al. | 2019-01-31 |
Method For Manufacturing Bonded Soi Wafer App 20180122639 - KOBAYASHI; Norihiro ;   et al. | 2018-05-03 |
Method For Manufacturing A Bonded Soi Wafer App 20170040210 - WAKABAYASHI; Taishi ;   et al. | 2017-02-09 |
Method For Manufacturing A Bonded Soi Wafer And Bonded Soi Wafer App 20170033002 - MEGURO; Kenji ;   et al. | 2017-02-02 |
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