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Patent applications and USPTO patent grants for Wakabayashi; Itsuo.The latest application filed is for "binding structure of wire routing material".
Patent | Date |
---|---|
Binding structure of wire routing material, and engaging member Grant 11,052,839 - Iwahara , et al. July 6, 2 | 2021-07-06 |
Binding structure of wire routing material Grant 10,981,522 - Kato , et al. April 20, 2 | 2021-04-20 |
Binding Structure Of Wire Routing Material App 20210031709 - KATO; Makoto ;   et al. | 2021-02-04 |
Binding Structure Of Wire Routing Material, And Engaging Member App 20200290531 - IWAHARA; Toshio ;   et al. | 2020-09-17 |
Engaging member Grant 10,737,643 - Kamiya , et al. A | 2020-08-11 |
Binding structure of wire routing material Grant 10,666,034 - Tokunaga , et al. | 2020-05-26 |
Binding Structure Of Wire Routing Material App 20200119536 - TOKUNAGA; Atsushi ;   et al. | 2020-04-16 |
Engaging Member App 20200114840 - KAMIYA; Haruhisa ;   et al. | 2020-04-16 |
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