Waidhas; Bernd

Patent Applications and Registrations

Patent applications and USPTO patent grants for Waidhas; Bernd.The latest application filed is for "integrated circuit package redistribution layers with metal-insulator-metal (mim) capacitors".

Company Profile

55.41.82

Waidhas; Bernd - Pettendorf DE
Waidhas; Bernd - Pettendorf/Neudorf N/A DE
Waidhas; Bernd - Sinzing DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Package Redistribution Layers With Metal-insulator-metal (mim) Capacitors App 20220310777 - O'Sullivan; David ; et al.	2022-09-29
Magnetic coils in locally thinned silicon bridges and methods of assembling same Grant 11,456,116 - Augustin , et al. September 27, 2	2022-09-27
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same App 20220294115 - Augustin; Andreas ; et al.	2022-09-15
Fan out package with integrated peripheral devices and methods Grant 11,404,339 - Keser , et al. August 2, 2	2022-08-02
Bare-die Smart Bridge Connected With Copper Pillars For System-in-package Apparatus App 20220238440 - SEIDEMANN; Georg ; et al.	2022-07-28
Fan out package-on-package with adhesive die attach Grant 11,380,616 - O'Sullivan , et al. July 5, 2	2022-07-05
Patch antennas stitched to systems in packages and methods of assembling same Grant 11,374,323 - Augustin , et al. June 28, 2	2022-06-28
Assembly Of 2xd Module Using High Density Interconnect Bridges App 20220199562 - WAIDHAS; Bernd ; et al.	2022-06-23
Bare-die Smart Bridge Connected With Copper Pillars For System-in-package Apparatus App 20220115323 - SEIDEMANN; Georg ; et al.	2022-04-14
Bare-die smart bridge connected with copper pillars for system-in-package apparatus Grant 11,270,941 - Seidemann , et al. March 8, 2	2022-03-08
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20220051990 - Keser; Lizabeth ; et al.	2022-02-17
Printed Wiring-board Islands For Connecting Chip Packages And Methods Of Assembling Same App 20220015244 - Seidemann; Georg ; et al.	2022-01-13
Face-up fan-out electronic package with passive components using a support Grant 11,211,337 - Keser , et al. December 28, 2	2021-12-28
Vertical and lateral interconnects between dies Grant 11,177,220 - Seidemann , et al. November 16, 2	2021-11-16
Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus Grant 11,145,577 - Koller , et al. October 12, 2	2021-10-12
Printed wiring-board islands for connecting chip packages and methods of assembling same Grant 11,134,573 - Seidemann , et al. September 28, 2	2021-09-28
Semiconductor inductors Grant 11,127,813 - Seidemann , et al. September 21, 2	2021-09-21
Antenna With Graded Dielectirc And Method Of Making The Same App 20210273342 - Maruthamuthu; Saravana ; et al.	2021-09-02
Stress Relief Die Implementation App 20210193594 - STOECKL; Stephan ; et al.	2021-06-24
Antenna with graded dielectirc and method of making the same Grant 11,031,699 - Maruthamuthu , et al. June 8, 2	2021-06-08
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory Grant 11,018,114 - Waidhas , et al. May 25, 2	2021-05-25
Component magnetic shielding for microelectronic devices Grant 10,867,934 - Maruthamuthu , et al. December 15, 2	2020-12-15
Printed Wiring-board Islands For Connecting Chip Packages And Methods Of Assembling Same App 20200352035 - Seidemann; Georg ; et al.	2020-11-05
Embedded-bridge Substrate Connectors And Methods Of Assembling Same App 20200328182 - WAIDHAS; Bernd ; et al.	2020-10-15
Method To Implement Wafer-level Chip-scale Packages With Grounded Conformal Shield App 20200312781 - SIGNORINI; Gianni ; et al.	2020-10-01
Fan Out Package With Integrated Peripheral Devices And Methods App 20200303274 - Keser; Lizabeth ; et al.	2020-09-24
Fan Out Package And Methods App 20200251396 - Kind Code	2020-08-06
Embedded-bridge substrate connectors and methods of assembling same Grant 10,727,197 - Waidhas , et al.	2020-07-28
Molded substrate package in fan-out wafer level package Grant 10,720,393 - Keser , et al.	2020-07-21
Semiconductor Packages, and Methods for Forming Semiconductor Packages App 20200227388 - Waidhas; Bernd ; et al.	2020-07-16
Fan out package with integrated peripheral devices and methods Grant 10,699,980 - Keser , et al.	2020-06-30
Semiconductor Inductors App 20200185490 - Seidemann; Georg ; et al.	2020-06-11
Package including an integrated routing layer and a molded routing layer Grant 10,665,522 - Keser , et al.	2020-05-26
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device Grant 10,658,201 - Koller , et al.	2020-05-19
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same App 20200144723 - Augustin; Andreas ; et al.	2020-05-07
Vertical And Lateral Interconnects Between Dies App 20200126922 - Seidemann; Georg ; et al.	2020-04-23
Power mesh-on-die trace bumping Grant 10,629,731 - Waidhas , et al.	2020-04-21
Magnetic Coils In Locally Thinned Silicon Bridges And Methods Of Assembling Same App 20200111607 - Augustin; Andreas ; et al.	2020-04-09
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20200105678 - Keser; Lizabeth ; et al.	2020-04-02
Novel Wafer Level Chip Scale Package (wlcsp), Flip-chip Chip Scale Package (fccsp), And Fan Out Shielding Concepts App 20200098698 - PATTEN; Richard ; et al.	2020-03-26
Package Devices Having A Ball Grid Array With Side Wall Contact Pads App 20200066692 - WOLTER; Andreas ; et al.	2020-02-27
Semiconductor package having a variable redistribution layer thickness Grant 10,553,538 - Reingruber , et al. Fe	2020-02-04
Face-up fan-out electronic package with passive components using a support Grant 10,546,817 - Keser , et al. Ja	2020-01-28
Chip Scale Thin 3d Die Stacked Package App 20200006293 - SANKMAN; Robert ; et al.	2020-01-02
Through-silicon Via Pillars For Connecting Dice And Methods Of Assembling Same App 20200006272 - Augustin; Andreas ; et al.	2020-01-02
Packages Of Stacking Integrated Circuits App 20190393191 - REINGRUBER; Klaus ; et al.	2019-12-26
Molded Substrate Package In Fan-out Wafer Level Package App 20190393154 - Keser; Lizabeth ; et al.	2019-12-26
Fan Out Package-on-package With Adhesive Die Attach App 20190355659 - O'Sullivan; David ; et al.	2019-11-21
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory App 20190341371 - Waidhas; Bernd ; et al.	2019-11-07
Interconnect Structure For A Microelectronic Device App 20190333886 - Reingruber; Klaus ; et al.	2019-10-31
Fan Out Packaging Pop Mechanical Attach Method App 20190312016 - O'Sullivan; David ; et al.	2019-10-10
Fan Out Package With Integrated Peripheral Devices And Methods App 20190304863 - Keser; Lizabeth ; et al.	2019-10-03
Component Magnetic Shielding For Microelectronic Devices App 20190304922 - Maruthamuthu; Saravana ; et al.	2019-10-03
Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same Grant 10,431,545 - Seidemann , et al. O	2019-10-01
Electromagnetic Shielding Cap, An Electrical System And A Method For Forming An Electromagnetic Shielding Cap App 20190297758 - KOLLER; Sonja ; et al.	2019-09-26
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device App 20190295857 - Koller; Sonja ; et al.	2019-09-26
Bare-die Smart Bridge Connected With Copper Pillars For System-in-package Apparatus App 20190287904 - Seidemann; Georg ; et al.	2019-09-19
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory Grant 10,403,602 - Waidhas , et al. Sep	2019-09-03
Molded substrate package in fan-out wafer level package Grant 10,403,580 - Keser , et al. Sep	2019-09-03
Lead Frame With Angular Deflections And Wrapped Printed Wiring Boards For System-in-package Apparatus App 20190267312 - Koller; Sonja ; et al.	2019-08-29
Wearable electronic devices and components thereof Grant 10,394,280 - Meyer , et al. A	2019-08-27
Antenna With Graded Dielectirc And Method Of Making The Same App 20190252792 - Maruthamuthu; Saravana ; et al.	2019-08-15
Interconnect structure for a microelectronic device Grant 10,366,968 - Reingruber , et al. July 30, 2	2019-07-30
Systems, Methods, And Apparatuses For Implementing Reduced Height Semiconductor Packages For Mobile Electronics App 20190214369 - SEIDEMANN; Georg ; et al.	2019-07-11
Thermal Conduction Devices And Methods For Embedded Electronic Devices App 20190214327 - Koller; Sonja ; et al.	2019-07-11
Power Mesh-on-die Trace Bumping App 20190207027 - Waidhas; Bernd ; et al.	2019-07-04
Molded Substrate Package In Fan-out Wafer Level Package App 20190206800 - Keser; Lizabeth ; et al.	2019-07-04
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20190206799 - Keser; Lizabeth ; et al.	2019-07-04
Interposer With Angled Vias App 20190206777 - Koller; Sonja ; et al.	2019-07-04
Fan Out Package And Methods App 20190198478 - Keser; Lizabeth ; et al.	2019-06-27
Anisotropically Conductive Elastic Adhesive Films In Semiconductor Device Packages And Methods Of Assembling Same App 20190198448 - Koller; Sonja ; et al.	2019-06-27
Power mesh-on-die trace bumping Grant 10,263,106 - Waidhas , et al.	2019-04-16
Semiconductor Package Having A Variable Redistribution Layer Thickness App 20190043800 - REINGRUBER; Klaus Jurgen ; et al.	2019-02-07
Smart Accelerometer Cantilever App 20190004083 - Koller; Sonja ; et al.	2019-01-03
Cross-connected Multi-chip Modules Coupled By Silicon Bent-bridge Interconnects And Methods Of Assembling Same App 20190006281 - Seidemann; Georg ; et al.	2019-01-03
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory App 20190006318 - Waidhas; Bernd ; et al.	2019-01-03
Bent-bridge semiconductive apparatus Grant 10,141,265 - Waidhas , et al. Nov	2018-11-27
Semiconductor package having a variable redistribution layer thickness Grant 10,115,668 - Reingruber , et al. October 30, 2	2018-10-30
Filler Interface Heat Transfer System And Devices And Methods For Same App 20180284851 - Seidemann; Georg ; et al.	2018-10-04
Power Mesh-on-die Trace Bumping App 20180286798 - Waidhas; Bernd ; et al.	2018-10-04
Embedded-bridge Substrate Connectors And Methods Of Assembling Same App 20180277512 - Waidhas; Bernd ; et al.	2018-09-27
Bent-bridge Semiconductive Apparatus App 20180190589 - Waidhas; Bernd ; et al.	2018-07-05
Wearable Electronic Devices And Components Thereof App 20180157289 - Meyer; Thorsten ; et al.	2018-06-07
Interconnect Structure For A Microelectronic Device App 20180096970 - Reingruber; Klaus ; et al.	2018-04-05
Wearable electronic devices and components thereof Grant 9,904,321 - Meyer , et al. February 27, 2	2018-02-27
Flip-chip Package With Thermal Dissipation Layer App 20170178999 - Patten; Richard ; et al.	2017-06-22
Semiconductor Package Having A Variable Redistribution Layer Thickness App 20170170111 - REINGRUBER; Klaus Jurgen ; et al.	2017-06-15
Wearable Electronic Devices And Components Thereof App 20160274621 - Meyer; Thorsten ; et al.	2016-09-22
Semiconductor devices Grant 9,385,105 - Meyer , et al. July 5, 2	2016-07-05
Enhanced flip chip package Grant 9,059,304 - Meyer , et al. June 16, 2	2015-06-16
Semiconductor Devices App 20150028478 - Meyer; Thorsten ; et al.	2015-01-29
Chip Package And A Method For Manufacturing A Chip Package App 20140151700 - Meyer; Thorsten ; et al.	2014-06-05
Enhanced Flip Chip Package App 20140138827 - Meyer; Thorsten ; et al.	2014-05-22
Enhanced flip chip package Grant 8,716,859 - Meyer , et al. May 6, 2	2014-05-06
Method and system for routing electrical connections of semiconductor chips Grant 8,598,709 - Meyer , et al. December 3, 2	2013-12-03
Rotated Semiconductor Device Fan-out Wafer Level Packages And Methods Of Manufacturing Rotated Semiconductor Device Fan-out Wafer Level Packages App 20130256883 - Meyer; Thorsten ; et al.	2013-10-03
Enhanced Flip Chip Package App 20130175686 - Meyer; Thorsten ; et al.	2013-07-11
Semiconductor component including a semiconductor chip and a passive component Grant 8,471,393 - Meyer , et al. June 25, 2	2013-06-25
Method And System For Routing Electrical Connections Of Semiconductor Chips App 20120049375 - MEYER; Thorsten ; et al.	2012-03-01
Semiconductor component including a semiconductor chip and a passive component App 20080135977 - Meyer; Thorsten ; et al.	2008-06-12
Electronic component and electronic configuration Grant 7,183,652 - Waidhas , et al. February 27, 2	2007-02-27
Electronic component and electronic configuration App 20070018308 - Schott; Albert ; et al.	2007-01-25
Electronic component and electronic configuration App 20060244142 - Waidhas; Bernd ; et al.	2006-11-02
Electronic package having integrated cooling element with clearance for engaging package Grant 7,064,429 - Bemmerl , et al. June 20, 2	2006-06-20
Optoelectronic surface-mountable module and optoelectronic coupling unit Grant 6,550,982 - Auburger , et al. April 22, 2	2003-04-22
Optoelectronic surface-mountable module and optoelectronic coupling unit App 20020021871 - Auburger, Albert ; et al.	2002-02-21

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