Waffer Technology Corp.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Waffer Technology Corp..The latest application filed is for "fastening device for heat slug".
- Waffer Technology Corp. - Taoyuan TW
- WAFFER TECHNOLOGY CORP. -
- Waffer Technology Corp. - Tao Yuan TW
- Waffer Technology Corp. - Taoyuan Hsien TW
- Waffer Technology Corp. - TW TW
- Waffer Technology Corporation - Taoyuan Hsien TW
Trademarks
| Patent | Date |
|---|---|
| Internally disposed cooling device for electronic apparatus Grant 7,190,576 - Wang , et al. March 13, 2 | 2007-03-13 |
| Water-cooling heat dissipation system Grant 7,069,737 - Wang , et al. July 4, 2 | 2006-07-04 |
| Heat dissipating device having improved fastening structure Grant 7,019,979 - Wang , et al. March 28, 2 | 2006-03-28 |
| Fastening structure of heat sink Grant 6,968,889 - Wang , et al. November 29, 2 | 2005-11-29 |
| Fastening device for heat slug App 20040130875 - Wang, Jack ; et al. | 2004-07-08 |
| Nail cartridge structure for nail gun Grant 6,729,523 - Wang , et al. May 4, 2 | 2004-05-04 |
| Positioning and buckling structure for use in a radiator Grant 6,672,379 - Wang , et al. January 6, 2 | 2004-01-06 |
| Positioning structure for heat dissipating fins Grant 6,607,028 - Wang , et al. August 19, 2 | 2003-08-19 |
| Heat sink assembly Grant 6,595,275 - Wang , et al. July 22, 2 | 2003-07-22 |
| Heat dissipating fin Grant 6,571,862 - Wang , et al. June 3, 2 | 2003-06-03 |
| Heat dissipating device for a CPU Grant 6,542,370 - Wang , et al. April 1, 2 | 2003-04-01 |
| Heat dissipater for a central processing unit Grant 6,477,045 - Wang November 5, 2 | 2002-11-05 |
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