loadpatents
name:-0.012233972549438
name:-0.010226964950562
name:-0.0064551830291748
WADA; Takuma Patent Filings

WADA; Takuma

Patent Applications and Registrations

Patent applications and USPTO patent grants for WADA; Takuma.The latest application filed is for "method of making a semiconductor manufacturing apparatus member".

Company Profile
6.10.12
  • WADA; Takuma - KITAKYUSHU-SHI JP
  • Wada; Takuma - Kitakyushu JP
  • Wada; Takuma - Fukuoka JP
  • Wada; Takuma - Fukuoka-Ken JP
  • Wada; Takuma - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method Of Making A Semiconductor Manufacturing Apparatus Member
App 20220139676 - NITTA; Yasutaka ;   et al.
2022-05-05
Semiconductor manufacturing apparatus member, and display manufacturing apparatus and semiconductor manufacturing apparatus comprising semiconductor manufacturing apparatus member
Grant 11,142,829 - Nitta , et al. October 12, 2
2021-10-12
Composite structure
Grant 11,117,356 - Wada September 14, 2
2021-09-14
Composite structure, semiconductor manufacturing apparatus and display manufacturing apparatus provided with composite structure
Grant 10,759,710 - Iwasawa , et al. Sep
2020-09-01
Semiconductor Manufacturing Apparatus Member, And Display Manufacturing Apparatus And Semiconductor Manufacturing Apparatus Comp
App 20200270753 - NITTA; Yasutaka ;   et al.
2020-08-27
Semiconductor Manufacturing Apparatus Member, And Display Manufacturing Apparatus And Semiconductor Manufacturing Apparatus Comp
App 20200273675 - NITTA; Yasutaka ;   et al.
2020-08-27
Semiconductor Manufacturing Apparatus Member, And Display Manufacturing Apparatus And Semiconductor Manufacturing Apparatus Comp
App 20200273674 - NITTA; Yasutaka ;   et al.
2020-08-27
Electrostatic chuck and wafer processing apparatus
Grant 10,714,373 - Anada , et al.
2020-07-14
Composite Structure, Semiconductor Manufacturing Apparatus And Display Manufacturing Apparatus Provided With Composite Structure
App 20190276368 - IWASAWA; Junichi ;   et al.
2019-09-12
Composite Structure
App 20190240961 - Wada; Takuma
2019-08-08
Electrostatic Chuck And Wafer Processing Apparatus
App 20180040499 - ANADA; Kazuki ;   et al.
2018-02-08
Electrostatic chuck
Grant 9,300,229 - Anada , et al. March 29, 2
2016-03-29
Electrostatic chuck
Grant 9,252,040 - Anada , et al. February 2, 2
2016-02-02
Electrostatic chuck
Grant 9,252,041 - Anada , et al. February 2, 2
2016-02-02
Electrostatic chuck
Grant 9,042,078 - Wada , et al. May 26, 2
2015-05-26
Electrostatic Chuck
App 20140355170 - Wada; Takuma ;   et al.
2014-12-04
Electrostatic Chuck
App 20140071582 - ANADA; Kazuki ;   et al.
2014-03-13
Electrostatic Chuck
App 20140063682 - ANADA; Kazuki ;   et al.
2014-03-06
Electrostatic Chuck
App 20140063681 - ANADA; Kazuki ;   et al.
2014-03-06
Dynamoelectric machine and method for manufacturing a rotor therefor
Grant 8,368,274 - Yoshizawa , et al. February 5, 2
2013-02-05
Dynamoelectric Machine And Method For Manufacturing A Rotor Therefor
App 20110181142 - Yoshizawa; Toshiyuki ;   et al.
2011-07-28

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