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Patent applications and USPTO patent grants for Wada; Norio.The latest application filed is for "substrate processing apparatus and substrate processing method".
Patent | Date |
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Bonding apparatus and bonding method Grant 10,964,563 - Wada , et al. March 30, 2 | 2021-03-30 |
Substrate Processing Apparatus And Substrate Processing Method App 20210035827 - Motoda; Kimio ;   et al. | 2021-02-04 |
Bonding Apparatus And Bonding Method App 20180323089 - Wada; Norio ;   et al. | 2018-11-08 |
Bonding apparatus, bonding system and bonding method Grant 9,469,093 - Wada , et al. October 18, 2 | 2016-10-18 |
Bonding method, bonding apparatus and bonding system Grant 9,165,803 - Furutani , et al. October 20, 2 | 2015-10-20 |
Dye adsorption apparatus and dye adsorption method Grant 9,093,222 - Furutani , et al. July 28, 2 | 2015-07-28 |
Bonding apparatus, bonding system and bonding method Grant 9,005,385 - Wada , et al. April 14, 2 | 2015-04-14 |
Film-forming Apparatus And Film-forming Method App 20150072075 - WADA; Norio | 2015-03-12 |
Bonding Method, Bonding Apparatus And Bonding System App 20140329341 - Furutani; Goro ;   et al. | 2014-11-06 |
Bonding Apparatus, Bonding System And Bonding Method App 20140318711 - Wada; Norio ;   et al. | 2014-10-30 |
Bonding Apparatus, Bonding System And Bonding Method App 20140318680 - Wada; Norio ;   et al. | 2014-10-30 |
Dye Adsorption Device, Dye Adsorption Method And Substrate Treatment Apparatus App 20130323934 - Wada; Norio ;   et al. | 2013-12-05 |
Dye Adsorption Apparatus And Dye Adsorption Method App 20130316485 - Furutani; Goro ;   et al. | 2013-11-28 |
Friction material for brakes App 20080160260 - Wada; Norio ;   et al. | 2008-07-03 |
Tape automated bonding in semiconductor technique Grant 5,384,204 - Yumoto , et al. January 24, 1 | 1995-01-24 |
Semiconductor device having tab tape Grant 5,365,107 - Kuraishi , et al. November 15, 1 | 1994-11-15 |
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