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name:-0.012180089950562
name:-0.0085740089416504
name:-0.0034620761871338
Wada; Norio Patent Filings

Wada; Norio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wada; Norio.The latest application filed is for "substrate processing apparatus and substrate processing method".

Company Profile
2.8.11
  • Wada; Norio - Kumamoto JP
  • Wada; Norio - Koshi-shi Kumamoto
  • Wada; Norio - Koshi JP
  • Wada; Norio - Kikuchi-gun JP
  • Wada; Norio - Nagoya JP
  • Wada; Norio - Nagano JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding apparatus and bonding method
Grant 10,964,563 - Wada , et al. March 30, 2
2021-03-30
Substrate Processing Apparatus And Substrate Processing Method
App 20210035827 - Motoda; Kimio ;   et al.
2021-02-04
Bonding Apparatus And Bonding Method
App 20180323089 - Wada; Norio ;   et al.
2018-11-08
Bonding apparatus, bonding system and bonding method
Grant 9,469,093 - Wada , et al. October 18, 2
2016-10-18
Bonding method, bonding apparatus and bonding system
Grant 9,165,803 - Furutani , et al. October 20, 2
2015-10-20
Dye adsorption apparatus and dye adsorption method
Grant 9,093,222 - Furutani , et al. July 28, 2
2015-07-28
Bonding apparatus, bonding system and bonding method
Grant 9,005,385 - Wada , et al. April 14, 2
2015-04-14
Film-forming Apparatus And Film-forming Method
App 20150072075 - WADA; Norio
2015-03-12
Bonding Method, Bonding Apparatus And Bonding System
App 20140329341 - Furutani; Goro ;   et al.
2014-11-06
Bonding Apparatus, Bonding System And Bonding Method
App 20140318711 - Wada; Norio ;   et al.
2014-10-30
Bonding Apparatus, Bonding System And Bonding Method
App 20140318680 - Wada; Norio ;   et al.
2014-10-30
Dye Adsorption Device, Dye Adsorption Method And Substrate Treatment Apparatus
App 20130323934 - Wada; Norio ;   et al.
2013-12-05
Dye Adsorption Apparatus And Dye Adsorption Method
App 20130316485 - Furutani; Goro ;   et al.
2013-11-28
Friction material for brakes
App 20080160260 - Wada; Norio ;   et al.
2008-07-03
Tape automated bonding in semiconductor technique
Grant 5,384,204 - Yumoto , et al. January 24, 1
1995-01-24
Semiconductor device having tab tape
Grant 5,365,107 - Kuraishi , et al. November 15, 1
1994-11-15

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