Wada; Fusazo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wada; Fusazo.The latest application filed is for "shrink-wrappped package".
- Wada; Fusazo - Moriyama JP
- WADA, FUSAZO - MORIYAMA-SHI JP
- Wada; Fusazo - Morikawara-cho Moriyama-shi JP
| Patent | Date |
|---|---|
| Shrink-wrapped package Grant 6,513,656 - Hanaoka , et al. February 4, 2 | 2003-02-04 |
| Shrink-wrappped Package App 20020179479 - HANAOKA, YUJI ; et al. | 2002-12-05 |
| Low temperature heat shrinkable film for labels Grant 6,270,866 - Okuda , et al. August 7, 2 | 2001-08-07 |
| Method for improving the internal surface of seamless tube of multi-layer plastics film laminate Grant 5,296,170 - Sugimoto , et al. March 22, 1 | 1994-03-22 |
| Food-packaging material and process for preparing the same Grant 4,888,223 - Sugimoto , et al. December 19, 1 | 1989-12-19 |
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