WACKER-SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG

USPTO Trademark & Patent Filings

Trademark applications and grants for Wacker-siltronic Gesellschaft Fur Halbleitermaterialien Ag. Wacker-siltronic Gesellschaft Fur Halbleitermaterialien Ag has 1 trademark applications. The latest application filed is for "FLASH!"

Company Profile

WACKER-SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
ag halbleitermaterialien fur gesellschaft siltronic wacker
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG -
Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG -
Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG -
Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG - DE DE
Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG - Burghausen DE

State Incorporated	GERMANY
Entity Type	LIMITED LIABILITY COMPANY
Address	Johannes-Hess-Strasse 24 D-84489 Burghausen GERMANY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents

Patent Applications

Patent Application	Date
Semiconductor wafer with a thin epitaxial silicon layer, and production process 20040144977 - 10/756035 Schauer, Reinhard ; et al.	2004-07-29
Silicon semiconductor substrate and method for production thereof 20030134520 - 10/241180 Tachikawa, Akiyoshi ; et al.	2003-07-17
Silicon semiconductor substrate and process for producing the same 20030079674 - 10/213470 Tachikawa, Akiyoshi ; et al.	2003-05-01
Semiconductor wafer with improved local flatness, and method for its production 20030060050 - 10/209121 Pietsch, Georg J. ; et al.	2003-03-27
Silicon semiconductor substrate and preparation thereof 20030056715 - 10/236273 Tachikawa, Akiyoshi ; et al.	2003-03-27
Method and device for the production of a single crystal 7,011,704 - 10/209,106 Altmannshofer March 14, 2	2006-03-14
Method and apparatus for doping a melt with a dopant 6,660,082 - 09/782,999 Weber , et al. December 9, 2	2003-12-09
Double-side polishing process with reduced scratch rate and device for carrying out the process 6,645,862 - 09/989,550 Wenski , et al. November 11, 2	2003-11-11
Method for separating slices from a hard brittle workpiece, and wire saw for carrying out the method 6,640,796 - 10/209,115 Egglhuber , et al. November 4, 2	2003-11-04
Method for the production of an epitaxially grown semiconductor wafer 6,630,024 - 09/864,994 Schmolke , et al. October 7, 2	2003-10-07

Patent Grants & Applications

Trademark Applications

Mark Image Registration \| Serial	Trademark Application Date
"FLASH!" 76128635	FLASH! 2000-09-14

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