| Patent | Date |
|---|
Stacked-die bulk acoustic wave oscillator package
Grant 11,387,782 - Jackson , et al. July 12, 2 | 2022-07-12 |
Stacked-Die Bulk Acoustic Wave Oscillator Package
App 20210126585 - Jackson; Ricky A. ; et al. | 2021-04-29 |
Floating Die Package
App 20210091012 - Cook; Benjamin Stassen ; et al. | 2021-03-25 |
Electronic Package For Integrated Circuits And Related Methods
App 20210090940 - Wachtler; Kurt Peter ; et al. | 2021-03-25 |
Stacked-die bulk acoustic wave oscillator package
Grant 10,892,712 - Jackson , et al. January 12, 2 | 2021-01-12 |
Sintered Metal Flip Chip Joints
App 20210005537 - Wachtler; Kurt Peter ; et al. | 2021-01-07 |
Electronic package for integrated circuits and related methods
Grant 10,861,741 - Wachtler , et al. December 8, 2 | 2020-12-08 |
Floating die package
Grant 10,861,796 - Cook , et al. December 8, 2 | 2020-12-08 |
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20200354214 - Wachtler; Kurt Peter ; et al. | 2020-11-12 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
Grant 10,723,616 - Wachtler , et al. | 2020-07-28 |
Stacked-Die Bulk Acoustic Wave Oscillator Package
App 20200153387 - Jackson; Ricky A. ; et al. | 2020-05-14 |
Stacked-die bulk acoustic wave oscillator package
Grant 10,574,184 - Jackson , et al. Feb | 2020-02-25 |
Stacked-die Bulk Acoustic Wave Oscillator Package
App 20190341885 - JACKSON; RICKY A. ; et al. | 2019-11-07 |
Integrated Circuit Package With Partitioning Based On Environmental Sensitivity
App 20190206806 - MALE; Barry Jon ; et al. | 2019-07-04 |
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20190169019 - Wachtler; Kurt Peter ; et al. | 2019-06-06 |
Electronic Package For Integrated Circuits And Related Methods
App 20190164807 - Wachtler; Kurt Peter ; et al. | 2019-05-30 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
Grant 10,233,074 - Wachtler , et al. | 2019-03-19 |
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20180127266 - Wachtler; Kurt Peter ; et al. | 2018-05-10 |
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
Grant 9,896,330 - Wachtler , et al. February 20, 2 | 2018-02-20 |
Floating Die Package
App 20170330841 - Cook; Benjamin Stassen ; et al. | 2017-11-16 |
Sintered Metal Flip Chip Joints
App 20170309549 - Wachtler; Kurt Peter ; et al. | 2017-10-26 |
Structure And Method For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20170197823 - Wachtler; Kurt Peter ; et al. | 2017-07-13 |
Die underfill structure and method
Grant 8,823,168 - Wachtler September 2, 2 | 2014-09-02 |
Die Underfill Structure And Method
App 20140061896 - Wachtler; Kurt Peter | 2014-03-06 |
Stackable plasma cleaned via package and method
Grant 8,338,229 - Bancod , et al. December 25, 2 | 2012-12-25 |
Flexible Interposer for Stacking Semiconductor Chips and Connecting Same to Substrate
App 20110165735 - Wachtler; Kurt Peter | 2011-07-07 |
Flexible interposer for stacking semiconductor chips and connecting same to substrate
Grant 7,928,550 - Wachtler April 19, 2 | 2011-04-19 |
Method for Cleaning Insulating Coats from Metal Contact Surfaces
App 20110011424 - GERBER; Mark Allen ; et al. | 2011-01-20 |
Flexible Interposer for Stacking Semiconductor Chips and Connecting Same to Substrate
App 20090121346 - Wachtler; Kurt Peter | 2009-05-14 |
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