Wachtler; Kurt P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wachtler; Kurt P..The latest application filed is for "heterogeneous integration of memory and split-architecture processor".

Company Profile

0.18.17

Wachtler; Kurt P. - Richardson TX
Wachtler; Kurt P - Richardson TX US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heterogeneous integration of memory and split-architecture processor Grant 9,312,253 - Lyne , et al. April 12, 2	2016-04-12
Heterogeneous Integration of Memory and Split-Architecture Processor App 20150111318 - Lyne; Kevin ; et al.	2015-04-23
3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor Grant 8,957,525 - Lyne , et al. February 17, 2	2015-02-17
3D Semiconductor Interposer for Heterogeneous Integration of Standard Memory and Split-Architecture Processor App 20140159247 - Lyne; Kevin ; et al.	2014-06-12
Method for exposing and cleaning insulating coats from metal contact surfaces Grant 8,430,969 - Gerber , et al. April 30, 2	2013-04-30
MEMS package having formed metal lid Grant 8,309,388 - Wachtler , et al. November 13, 2	2012-11-13
Packaged system of semiconductor chips having a semiconductor interposer Grant 8,133,761 - Gerber , et al. March 13, 2	2012-03-13
Flexible interposer for stacking semiconductor chips and connecting same to substrate Grant 8,030,137 - Wachtler October 4, 2	2011-10-04
Local Integration Of Non-linear Sheet I Integrated Circuit Packages For Esd/eos Protection App 20110075306 - Leduc; Yves ; et al.	2011-03-31
In package ESD protections of IC using a thin film polymer Grant 7,872,841 - Leduc , et al. January 18, 2	2011-01-18
MEMS Package Having Formed Metal Lid App 20090267223 - WACHTLER; Kurt P. ; et al.	2009-10-29
Packaged System of Semiconductor Chips Having a Semiconductor Interposer App 20090258459 - GERBER; Mark A. ; et al.	2009-10-15
Packed system of semiconductor chips having a semiconductor interposer Grant 7,573,139 - Gerber , et al. August 11, 2	2009-08-11
Semiconductor package-on-package system including integrated passive components Grant 7,569,918 - Gerber , et al. August 4, 2	2009-08-04
Semiconductor Package-on-Package System Including Integrated Passive Components App 20080315387 - GERBER; Mark A. ; et al.	2008-12-25
In Package Esd Protections Of Ic Using A Thin Film Polymer App 20080278873 - Leduc; Yves ; et al.	2008-11-13
High Input/Output, Low Profile Package-On-Package Semiconductor System App 20080258286 - Gerber; Mark A. ; et al.	2008-10-23
Packed System of Semiconductor Chips Having a Semiconductor Interposer App 20080246138 - GERBER; MARK A. ; et al.	2008-10-09
Packaged system of semiconductor chips having a semiconductor interposer Grant 7,390,700 - Gerber , et al. June 24, 2	2008-06-24
Semiconductor Package-on-Package System Including Integrated Passive Components App 20070254404 - Gerber; Mark A. ; et al.	2007-11-01
Packaged system of semiconductor chips having a semiconductor interposer App 20070235850 - Gerber; Mark A. ; et al.	2007-10-11
Low profile semiconductor system having a partial-cavity substrate App 20070170571 - Gerber; Mark A. ; et al.	2007-07-26
Method of separating semiconductor dies from a wafer App 20040129451 - Wachtler, Kurt P.	2004-07-08
HID land grid array packaged device having electrical and optical interconnects Grant 6,707,124 - Wachtler , et al. March 16, 2	2004-03-16
Method of separating semiconductor dies from a wafer Grant 6,686,225 - Wachtler February 3, 2	2004-02-03
Microactuator for use in mass data storage devices, or the like, and method for making same Grant 6,655,002 - Maimone , et al. December 2, 2	2003-12-02
Method of separating semiconductor dies from a wafer App 20030022465 - Wachtler, Kurt P.	2003-01-30
Semiconductor die with contoured bottom surface and method for making same App 20030020142 - Wachtler, Kurt P.	2003-01-30
Microelectricalmechanical device immobilization and sealing Grant 6,504,685 - Wachtler , et al. January 7, 2	2003-01-07
Symmetrical microactuator structure for use in mass data storage devices, or the like Grant 6,473,274 - Maimone , et al. October 29, 2	2002-10-29
"shrink Wrap" Conformal Coating Of A Chip-on-suspension In A Hard Disk Drive System App 20020093766 - WACHTLER, KURT P.	2002-07-18
Method for making microactuator for use in mass data storage devices Grant 6,374,481 - Wachtler , et al. April 23, 2	2002-04-23
HID land grid array packaged device having electrical and optical interconnects App 20010035576 - Wachtler, Kurt P. ; et al.	2001-11-01
HDI land grid array packaged device having electrical and optical interconnects Grant 6,274,391 - Wachtler , et al. August 14, 2	2001-08-14

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