Wachter; Ulrich

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wachter; Ulrich.The latest application filed is for "method of packaging integrated circuits".

Company Profile

0.17.19

Wachter; Ulrich - Regensburg DE
Wachter; Ulrich - Regenburg DE
Wachter; Ulrich - Eppingen DE
Wachter; Ulrich - Riedenburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of packaging integrated circuits Grant 9,806,056 - Wachter , et al. October 31, 2	2017-10-31
Package arrangement, a package, and a method of manufacturing a package arrangement Grant 9,718,678 - Wachter , et al. August 1, 2	2017-08-01
Package arrangement including external block comprising semiconductor material and electrically conductive plastic material Grant 9,711,462 - Beer , et al. July 18, 2	2017-07-18
Semiconductor device packaging Grant 9,620,457 - Wachter , et al. April 11, 2	2017-04-11
Method of packaging integrated circuits and a molded package Grant 9,487,392 - Wachter , et al. November 8, 2	2016-11-08
Method of Packaging Integrated Circuits App 20160163674 - Wachter; Ulrich ; et al.	2016-06-09
Package Arrangement, A Package, And A Method Of Manufacturing A Package Arrangement App 20160090294 - Wachter; Ulrich ; et al.	2016-03-31
Metal redistribution layer for molded substrates Grant 9,275,878 - Wachter , et al. March 1, 2	2016-03-01
Method For Forming A Package Arrangement And Package Arrangement App 20160035677 - Wachter; Ulrich ; et al.	2016-02-04
Method for fabricating a plurality of semiconductor devices Grant 9,147,585 - Kilger , et al. September 29, 2	2015-09-29
Molded semiconductor package with backside die metallization Grant 9,099,454 - Wachter , et al. August 4, 2	2015-08-04
Semiconductor Device Packaging App 20150145149 - Wachter; Ulrich ; et al.	2015-05-28
Metal Redistribution Layer for Molded Substrates App 20150091171 - Wachter; Ulrich ; et al.	2015-04-02
Semiconductor Device App 20150064846 - Kilger; Thomas ; et al.	2015-03-05
Molded Semiconductor Package with Backside Die Metallization App 20150041967 - Wachter; Ulrich ; et al.	2015-02-12
Method of Packaging Integrated Circuits and a Molded Package App 20150028435 - Wachter; Ulrich ; et al.	2015-01-29
Method of fabricating a chip package Grant 8,912,087 - Hirtreiter , et al. December 16, 2	2014-12-16
Method for fabricating a semiconductor device Grant 8,906,749 - Bauer , et al. December 9, 2	2014-12-09
Semiconductor device Grant 8,890,284 - Kilger , et al. November 18, 2	2014-11-18
Package Arrangement And Method Of Forming The Same App 20140332936 - Beer; Gottfried ; et al.	2014-11-13
Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound Grant 8,828,807 - Wachter , et al. September 9, 2	2014-09-09
Semiconductor Device App 20140239438 - Kilger; Thomas ; et al.	2014-08-28
Chip package and a method for manufacturing a chip package Grant 8,669,655 - Geitner , et al. March 11, 2	2014-03-11
Chip Package And A Method For Manufacturing A Chip Package App 20140035127 - Hirtreiter; Josef ; et al.	2014-02-06
Chip Package And A Method For Manufacturing A Chip Package App 20140035154 - Geitner; Ottmar ; et al.	2014-02-06
Method for Fabricating a Semiconductor Device App 20130256922 - Bauer; Michael ; et al.	2013-10-03
Cooking Vessel, Heating Device and Cooking System App 20130139704 - Schilling; Wilfried ; et al.	2013-06-06
Reconfigured wafer alignment Grant 7,943,423 - Pohl , et al. May 17, 2	2011-05-17
Reconfigured Wafer Alignment App 20100233831 - Pohl; Jens ; et al.	2010-09-16

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