Wachnik; Richard A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wachnik; Richard A..The latest application filed is for "integrated circuits with peltier cooling provided by back-end wiring".
- Wachnik; Richard A. - Mount Kisco NY
- Wachnik; Richard A. - Hopewell Junction NY
- Wachnik; Richard A. - Mt. Kisco NY
- Wachnik; Richard A. - Brewster NY
- Wachnik; Richard A. - Putnam County NY
| Patent | Date |
|---|---|
| Integrated circuits with Peltier cooling provided by back-end wiring Grant 10,103,083 - Koswatta , et al. October 16, 2 | 2018-10-16 |
| Integrated Circuits With Peltier Cooling Provided By Back-end Wiring App 20180053707 - Koswatta; Siyuranga O. ; et al. | 2018-02-22 |
| Integrated circuits with peltier cooling provided by back-end wiring Grant 9,773,717 - Koswatta , et al. September 26, 2 | 2017-09-26 |
| Buried signal transmission line Grant 9,484,246 - Chou , et al. November 1, 2 | 2016-11-01 |
| Precision trench capacitor Grant 9,240,406 - Feng , et al. January 19, 2 | 2016-01-19 |
| Buried Signal Transmission Line App 20150371893 - Chou; Anthony I. ; et al. | 2015-12-24 |
| Precision Trench Capacitor App 20150303191 - Feng; Kai D. ; et al. | 2015-10-22 |
| Body contacts for FET in SOI SRAM array Grant 8,809,187 - Tan , et al. August 19, 2 | 2014-08-19 |
| Body Contacts For Fet In Soi Sram Array App 20140027851 - Tan; Yue ; et al. | 2014-01-30 |
| Body contacts for FET in SOI SRAM array Grant 8,338,292 - Tan , et al. December 25, 2 | 2012-12-25 |
| Voltage island performance/leakage screen monitor for IP characterization Grant 8,020,138 - Balch , et al. September 13, 2 | 2011-09-13 |
| Highly tunable metal-on-semiconductor trench varactor Grant 7,989,922 - Mann , et al. August 2, 2 | 2011-08-02 |
| Body Contacts For Fet In Soi Sram Array App 20100207213 - Tan; Yue ; et al. | 2010-08-19 |
| Voltage Island Performance/leakage Screen Monitor For Ip Characterization App 20090295402 - Balch; Bruce ; et al. | 2009-12-03 |
| Dual damascene multi-level metallization Grant 7,470,613 - Agarwala , et al. December 30, 2 | 2008-12-30 |
| Dual-damascene metallization interconnection Grant 7,224,063 - Agarwala , et al. May 29, 2 | 2007-05-29 |
| Dual Damascene Multi-level Metallization App 20070111510 - Agarwala; Birendra N. ; et al. | 2007-05-17 |
| Alpha particle shield for integrated circuit Grant 6,531,759 - Wachnik , et al. March 11, 2 | 2003-03-11 |
| Electrically porous on-chip decoupling/shielding layer Grant 6,518,670 - Mandelman , et al. February 11, 2 | 2003-02-11 |
| Dual damascene multi-level metallization App 20020182855 - Agarwala, Birendra N. ; et al. | 2002-12-05 |
| Alpha particle shield for integrated circuit App 20020105059 - Wachnik, Richard A. ; et al. | 2002-08-08 |
| Process for producing metal interconnections and product produced thereby Grant 6,417,572 - Chidambarrao , et al. July 9, 2 | 2002-07-09 |
| Electromigration resistant power distribution network Grant 6,202,191 - Filippi , et al. March 13, 2 | 2001-03-13 |
| Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity Grant 6,069,068 - Rathore , et al. May 30, 2 | 2000-05-30 |
| Method of producing planar metal-to-metal capacitor for use in integrated circuits Grant 6,069,051 - Nguyen , et al. May 30, 2 | 2000-05-30 |
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