Vu; Quat
Patent Applications and Registrations
Patent applications and USPTO patent grants for Vu; Quat.The latest application filed is for "cof packaged semiconductor".
- Vu; Quat - Santa Clara CA
| Patent | Date |
|---|---|
| Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures Grant 7,189,596 - Mu , et al. March 13, 2 | 2007-03-13 |
| COF packaged semiconductor Grant 6,737,754 - Ma , et al. May 18, 2 | 2004-05-18 |
| Method for reduced capacitance interconnect system using gaseous implants into the ILD Grant 6,656,822 - Doyle , et al. December 2, 2 | 2003-12-02 |
| Process for forming microelectronic packages and intermediate structures formed therewith Grant 6,586,836 - Ma , et al. July 1, 2 | 2003-07-01 |
| COF packaged semiconductor App 20020185745 - Ma, Qing ; et al. | 2002-12-12 |
| Method For Reduced Capacitance Interconnect System Using Gaseous Implants Into The Ild App 20020090791 - DOYLE, BRIAN S. ; et al. | 2002-07-11 |
| Cladding of an interconnect for improved electromigration performance Grant 5,909,635 - Marieb , et al. June 1, 1 | 1999-06-01 |
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