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Silacycloalkane compounds and methods for depositing silicon containing films using same Grant 11,043,374 - Xiao , et al. June 22, 2 | 2021-06-22 |
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Precursors And Flowable CVD Methods For Making Low-K Films To Fill Surface Features App 20200058496 - Li; Jianheng ;   et al. | 2020-02-20 |
Silicon Compounds And Methods For Depositing Films Using Same App 20200048286 - Xiao; Manchao ;   et al. | 2020-02-13 |
Precursors and flowable CVD methods for making low-K films to fill surface features Grant 10,468,244 - Li , et al. No | 2019-11-05 |
Compositions And Methods Using Same For Deposition Of Silicon-containing Film App 20190292658 - Li; Jianheng ;   et al. | 2019-09-26 |
Alkyl-alkoxysilacyclic compounds Grant 10,395,920 - Vrtis , et al. A | 2019-08-27 |
Use of Silicon Structure Former with Organic Substituted Hardening Additive Compounds for Dense OSG Films App 20190244810 - Vrtis; Raymond Nicholas ;   et al. | 2019-08-08 |
Method and precursors for manufacturing 3D devices Grant 10,354,860 - Li , et al. July 16, 2 | 2019-07-16 |
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Silacyclic Compounds and Methods for Depositing Silicon-Containing Films Using Same App 20190134663 - Lei; Xinjian ;   et al. | 2019-05-09 |
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Compositions and Methods Using Same for Deposition of Silicon-Containing Film App 20190017167 - Vrtis; Raymond Nicholas ;   et al. | 2019-01-17 |
Precursors and Flowable CVD Methods for Making Low-K Films to Fill Surface Features App 20180315598 - Li; Jianheng ;   et al. | 2018-11-01 |
Compositions and methods using same for deposition of silicon-containing film Grant 10,106,890 - Li , et al. October 23, 2 | 2018-10-23 |
Method and Composition for Providing Pore Sealing Layer on Porous Low Dielectric Constant Films App 20180277360 - Li; Jianheng ;   et al. | 2018-09-27 |
Alkyl-Alkoxysilacyclic Compounds And Methods For Depositing Films Using Same App 20180233355 - Vrtis; Raymond Nicholas ;   et al. | 2018-08-16 |
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Use Of Silyl Bridged Alkyl Compounds For Dense Osg Films App 20180122632 - Vrtis; Raymond Nicholas ;   et al. | 2018-05-03 |
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Precursors and Flowable CVD Methods for Making Low-K Films to Fill Surface Features App 20180061636 - Li; Jianheng ;   et al. | 2018-03-01 |
Process For Depositing Porous Organosilicate Glass Films For Use As Resistive Random Access Memory App 20180047898 - RIDGEWAY; Robert Gordon ;   et al. | 2018-02-15 |
Compositions And Methods Using Same For Deposition Of Silicon-containing Film App 20170335449 - LI; Jianheng ;   et al. | 2017-11-23 |
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Method And Precursors For Manufacturing 3d Devices App 20160225616 - Li; Jianheng ;   et al. | 2016-08-04 |
Method And Composition For Providing Pore Sealing Layer On Porous Low Dielectric Constant Films App 20160049293 - Li; Jianheng ;   et al. | 2016-02-18 |
Alkyl-Alkoxysilacyclic Compounds and Methods for Depositing Films Using Same App 20150364321 - Vrtis; Raymond Nicholas ;   et al. | 2015-12-17 |
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Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 9,061,317 - Vrtis , et al. June 23, 2 | 2015-06-23 |
Low K precursors providing superior integration attributes Grant 9,018,107 - Haas , et al. April 28, 2 | 2015-04-28 |
Antireflective coatings for photovoltaic applications Grant 8,987,039 - Hurley , et al. March 24, 2 | 2015-03-24 |
Methods for using porogens for low k porous organosilica glass films Grant 8,951,342 - Vrtis , et al. February 10, 2 | 2015-02-10 |
Barrier Materials For Display Devices App 20150021599 - Ridgeway; Robert Gordon ;   et al. | 2015-01-22 |
Compositions And Methods For Making Silicon Containing Films App 20150014823 - Mallikarjunan; Anupama ;   et al. | 2015-01-15 |
Materials and Methods of Forming Controlled Void App 20140363950 - Vrtis; Raymond Nicholas ;   et al. | 2014-12-11 |
Dielectric barrier deposition using nitrogen containing precursor Grant 8,889,235 - Mallikarjunan , et al. November 18, 2 | 2014-11-18 |
Materials and methods of forming controlled void Grant 8,846,522 - Vrtis , et al. September 30, 2 | 2014-09-30 |
Low K Precursors Providing Superior Integration Attributes App 20140242813 - Haas; Mary Kathryn ;   et al. | 2014-08-28 |
Low k precursors providing superior integration attributes Grant 8,753,986 - Haas , et al. June 17, 2 | 2014-06-17 |
Dielectric barrier deposition using oxygen containing precursor Grant 8,637,396 - Matz , et al. January 28, 2 | 2014-01-28 |
Silicon Precursors And Compositions Comprising Same For Depositing Low Dielectric Constant Films App 20130260575 - Al-Rashid; Jennifer Elizabeth Antoline ;   et al. | 2013-10-03 |
Materials and Methods of Forming Controlled Void App 20130157435 - Vrtis; Raymond Nicholas ;   et al. | 2013-06-20 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants App 20130095255 - Vrtis; Raymond Nicholas ;   et al. | 2013-04-18 |
Materials and methods of forming controlled void Grant 8,399,349 - Vrtis , et al. March 19, 2 | 2013-03-19 |
Methods For Using Porogens For Low K Porous Organosilica Glass Films App 20120282415 - Vrtis; Raymond Nicholas ;   et al. | 2012-11-08 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 8,293,001 - Vrtis , et al. October 23, 2 | 2012-10-23 |
Process for restoring dielectric properties Grant 8,283,260 - Weigel , et al. October 9, 2 | 2012-10-09 |
Mechanical enhancer additives for low dielectric films Grant 8,137,764 - Vincent , et al. March 20, 2 | 2012-03-20 |
Low K Precursors Providing Superior Integration Attributes App 20110308937 - Haas; Mary Kathryn ;   et al. | 2011-12-22 |
Adhesion to copper and copper electromigration resistance Grant 8,043,976 - Vrtis , et al. October 25, 2 | 2011-10-25 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films With Low Dielectric Constants App 20110143032 - Vrtis; Raymond Nicholas ;   et al. | 2011-06-16 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 7,943,195 - Vrtis , et al. May 17, 2 | 2011-05-17 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure Grant 7,932,188 - Lukas , et al. April 26, 2 | 2011-04-26 |
Dielectric Barrier Deposition Using Nitrogen Containing Precursor App 20100291321 - Mallikarjunan; Anupama ;   et al. | 2010-11-18 |
Chemical vapor deposition method App 20100247803 - LEE; Eric M. ;   et al. | 2010-09-30 |
Dielectric Barrier Deposition Using Oxygen Containing Precursor App 20100136789 - Matz; Laura M. ;   et al. | 2010-06-03 |
Process For Restoring Dielectric Properties App 20100041234 - Weigel; Scott Jeffrey ;   et al. | 2010-02-18 |
Adhesion to Copper and Copper Electromigration Resistance App 20090236745 - Vrtis; Raymond Nicholas ;   et al. | 2009-09-24 |
Method for removing carbon-containing residues from a substrate Grant 7,581,549 - Johnson , et al. September 1, 2 | 2009-09-01 |
Antireflective Coatings For Photovoltaic Applications App 20090095346 - Hurley; Patrick Timothy ;   et al. | 2009-04-16 |
Antireflective Coatings App 20090096106 - Vrtis; Raymond Nicholas ;   et al. | 2009-04-16 |
Cyclopentene As A Precursor For Carbon-Based Films App 20090087796 - Vrtis; Raymond Nicholas ;   et al. | 2009-04-02 |
Activated chemical process for enhancing material properties of dielectric films Grant 7,500,397 - Weigel , et al. March 10, 2 | 2009-03-10 |
Mechanical Enhancement of Dense and Porous Organosilicate Materials by UV Exposure App 20090054674 - Lukas; Aaron Scott ;   et al. | 2009-02-26 |
Non-thermal process for forming porous low dielectric constant films Grant 7,470,454 - Lukas , et al. December 30, 2 | 2008-12-30 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure Grant 7,468,290 - Lukas , et al. December 23, 2 | 2008-12-23 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants App 20080271640 - Vrtis; Raymond Nicholas ;   et al. | 2008-11-06 |
Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films with Low Dielectric Constants App 20080268177 - Vrtis; Raymond Nicholas ;   et al. | 2008-10-30 |
Activated Chemical Process for Enhancing Material Properties of Dielectric Films App 20080199977 - Weigel; Scott Jeffrey ;   et al. | 2008-08-21 |
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Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants Grant 7,384,471 - Vrtis , et al. June 10, 2 | 2008-06-10 |
Porous low dielectric constant compositions and methods for making and using same Grant 7,332,445 - Lukas , et al. February 19, 2 | 2008-02-19 |
Materials And Methods Of Forming Controlled Void App 20080038934 - VRTIS; RAYMOND NICHOLAS ;   et al. | 2008-02-14 |
Curing Dielectric Films Under A Reducing Atmosphere App 20070299239 - Weigel; Scott Jeffrey ;   et al. | 2007-12-27 |
Method for removing a residue from a chamber App 20060196525 - Vrtis; Raymond Nicholas ;   et al. | 2006-09-07 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure Grant 7,098,149 - Lukas , et al. August 29, 2 | 2006-08-29 |
Low dielectric constant material and method of processing by CVD Grant 7,074,489 - O'Neill , et al. July 11, 2 | 2006-07-11 |
Porous low dielectric constant compositions and methods for making and using same App 20060078676 - Lukas; Aaron Scott ;   et al. | 2006-04-13 |
Method for removing carbon-containing residues from a substrate App 20060027249 - Johnson; Andrew David ;   et al. | 2006-02-09 |
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Cleaning CVD chambers following deposition of porogen-containing materials App 20050161060 - Johnson, Andrew David ;   et al. | 2005-07-28 |
Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants Grant 6,846,515 - Vrtis , et al. January 25, 2 | 2005-01-25 |
Mechanical enhancer additives for low dielectric films App 20040241463 - Vincent, Jean Louise ;   et al. | 2004-12-02 |
Method for enhancing deposition rate of chemical vapor deposition films App 20040197474 - Vrtis, Raymond Nicholas ;   et al. | 2004-10-07 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure App 20040175501 - Lukas, Aaron Scott ;   et al. | 2004-09-09 |
Mechanical enhancement of dense and porous organosilicate materials by UV exposure App 20040175957 - Lukas, Aaron Scott ;   et al. | 2004-09-09 |
Non-thermal process for forming porous low dielectric constant films App 20040096593 - Lukas, Aaron Scott ;   et al. | 2004-05-20 |
Non-thermal process for forming porous low dielectric constant films App 20040096672 - Lukas, Aaron Scott ;   et al. | 2004-05-20 |
Low dielectric constant material and method of processing by CVD Grant 6,716,770 - O'Neill , et al. April 6, 2 | 2004-04-06 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants App 20030232137 - Vrtis, Raymond Nicholas ;   et al. | 2003-12-18 |
Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants App 20030198742 - Vrtis, Raymond Nicholas ;   et al. | 2003-10-23 |
Low dielectric constant material and method of processing by CVD App 20030162034 - O'Neill, Mark Leonard ;   et al. | 2003-08-28 |
Deposition of titanium amides Grant 6,602,783 - Jahl , et al. August 5, 2 | 2003-08-05 |
Organosilicon precursors for interlayer dielectric films with low dielectric constants Grant 6,583,048 - Vincent , et al. June 24, 2 | 2003-06-24 |
Deposition of titanium amides App 20030072883 - Jahl, Matthias J. ;   et al. | 2003-04-17 |
Low dielectric constant material and method of processing by CVD App 20030049460 - O'Neill, Mark Leonard ;   et al. | 2003-03-13 |
Organosilicon Precursors For Interlayer Dielectric Films With Low Dielectric Constants App 20020142579 - Vincent, Jean Louise ;   et al. | 2002-10-03 |
Nonfunctionalized poly(arylene ethers) Grant 5,874,516 - Burgoyne, Jr. , et al. February 23, 1 | 1999-02-23 |
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