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Patent applications and USPTO patent grants for Vrtis; Joan K..The latest application filed is for "breath delivery system and method".
Patent | Date |
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Circuit board with embedded metal pallet and a method of fabricating the circuit board Grant 10,499,500 - Berkel , et al. De | 2019-12-03 |
Breath Delivery System And Method App 20190328279 - Landini; Barbara E. ;   et al. | 2019-10-31 |
Breath delivery system and method Grant 10,188,318 - Landini , et al. Ja | 2019-01-29 |
Rip stop on flex and rigid flex circuits Grant 10,015,880 - Bergman , et al. July 3, 2 | 2018-07-03 |
PCB hybrid redistribution layer Grant 10,009,992 - Vrtis , et al. June 26, 2 | 2018-06-26 |
Energy Device Embedded Copper Pallet App 20180132348 - Berkel; JH ;   et al. | 2018-05-10 |
Nano-copper via fill for enhanced thermal conductivity of plated through-hole via Grant 9,736,947 - Bergman , et al. August 15, 2 | 2017-08-15 |
Flexible printed circuit board hinge Grant 9,723,713 - Vrtis , et al. August 1, 2 | 2017-08-01 |
Pcb Hybrid Redistribution Layer App 20170164458 - Vrtis; Joan K. ;   et al. | 2017-06-08 |
Flexible circuit board and method of fabricating Grant 9,661,743 - Bergman , et al. May 23, 2 | 2017-05-23 |
Rigid to flexible PC transition Grant 9,549,463 - Vrtis , et al. January 17, 2 | 2017-01-17 |
Mechanical measures to limit stress and strain in deformable electronics Grant 9,521,748 - Bergman , et al. December 13, 2 | 2016-12-13 |
Embedded components in a substrate Grant 9,521,754 - Bergman , et al. December 13, 2 | 2016-12-13 |
Breath Delivery System and Method App 20120071737 - Landini; Barbara E. ;   et al. | 2012-03-22 |
Breath Delivery System and Method App 20090196796 - Landini; Barbara E. ;   et al. | 2009-08-06 |
Biosensor system with a multifunctional portable electronic device App 20090054799 - Vrtis; Joan K. ;   et al. | 2009-02-26 |
Semiconductor Device Package With Bump Overlying A Polymer Layer App 20090014869 - Vrtis; Joan K. ;   et al. | 2009-01-15 |
Method of a coating heat spreader Grant 7,219,421 - Vrtis , et al. May 22, 2 | 2007-05-22 |
Integrated Capacitor For Wafer Level Packaging Applications App 20060258048 - VRTIS; JOAN K. | 2006-11-16 |
Coated heat spreaders App 20040169998 - Vrtis, Joan K. ;   et al. | 2004-09-02 |
System and method for packaging electronic components App 20040160753 - Vrtis, Joan K. | 2004-08-19 |
Coating for a heat dissipation device and a method of fabrication App 20040125563 - Vrtis, Joan K. | 2004-07-01 |
Coated heat spreaders Grant 6,751,099 - Vrtis , et al. June 15, 2 | 2004-06-15 |
Coated heat spreaders App 20030117775 - Vrtis, Joan K. ;   et al. | 2003-06-26 |
Electronic package having embedded capacitors and method of fabrication therefor Grant 6,407,929 - Hale , et al. June 18, 2 | 2002-06-18 |
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