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Patent applications and USPTO patent grants for VORONOV; SERGEI.The latest application filed is for "wafer dicing methods".
Patent | Date |
---|---|
Wafer Dicing Methods App 20180233410 - JAMES; JOHN ;   et al. | 2018-08-16 |
Die or substrate marking using a laser Grant 9,472,505 - Evans , et al. October 18, 2 | 2016-10-18 |
Substrate markings Grant 9,430,685 - Voronov , et al. August 30, 2 | 2016-08-30 |
Die Or Substrate Marking Using A Laser App 20150171017 - Evans; Frank ;   et al. | 2015-06-18 |
Substrate Markings App 20140076976 - Voronov; Sergei ;   et al. | 2014-03-20 |
Work piece with concealed surface defects Grant 8,525,136 - Voronov September 3, 2 | 2013-09-03 |
Laser-assisted chemical singulation of a wafer Grant 8,426,250 - Vakanas , et al. April 23, 2 | 2013-04-23 |
Work Piece With Concealed Surface Defects App 20110195226 - Voronov; Sergei | 2011-08-11 |
Methods for concealing surface defects Grant 7,985,957 - Voronov July 26, 2 | 2011-07-26 |
Laser assisted chemical vapor deposition for backside die marking and structures formed thereby Grant 7,807,573 - Li , et al. October 5, 2 | 2010-10-05 |
Methods for concealing surface defects App 20100155625 - Voronov; Sergei | 2010-06-24 |
Wafer Singulation In High Volume Manufacturing App 20100129984 - Vakanas; George ;   et al. | 2010-05-27 |
Laser-assisted chemical singulation of a wafer App 20100099238 - Vakanas; George ;   et al. | 2010-04-22 |
Laser assisted chemical vapor deposition for backside die marking and structures formed thereby App 20100065971 - Li; Eric ;   et al. | 2010-03-18 |
Dicing and drilling of wafers App 20080242054 - Antonelli; Andy ;   et al. | 2008-10-02 |
Substrate Markings App 20080156780 - Voronov; Sergei ;   et al. | 2008-07-03 |
Mobile miniature X-ray source Grant 6,661,876 - Turner , et al. December 9, 2 | 2003-12-09 |
Mobile miniature X-ray source App 20030021377 - Turner, Clark ;   et al. | 2003-01-30 |
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