Volant; Richard Paul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Volant; Richard Paul.The latest application filed is for "circuit design checking for three dimensional chip technology".

Company Profile

0.12.10

Volant; Richard Paul - New Fairfield CT US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit design checking for three dimensional chip technology Grant 8,386,977 - Farooq , et al. February 26, 2	2013-02-26
Circuit Design Checking For Three Dimensional Chip Technology App 20120304138 - Farooq; Mukta G. ; et al.	2012-11-29
Method of making a sidewall-protected metallic pillar on a semiconductor substrate Grant 7,855,137 - Farooq , et al. December 21, 2	2010-12-21
Method for forming conductive structures Grant 7,833,893 - Grunow , et al. November 16, 2	2010-11-16
Method Of Making A Sidewall-protected Metallic Pillar On A Semiconductor Substrate App 20100038777 - Farooq; Mukta G. ; et al.	2010-02-18
Method For Forming Conductive Structures App 20090017616 - Grunow; Stephan ; et al.	2009-01-15
Internally reinforced bond pads Grant 7,273,804 - Angell , et al. September 25, 2	2007-09-25
Wedgebond pads having a nonplanar surface structure Grant 6,982,493 - Petrarca , et al. January 3, 2	2006-01-03
Internally reinforced bond pads App 20050121803 - Angell, David ; et al.	2005-06-09
Internally reinforced bond pads Grant 6,864,578 - Angell , et al. March 8, 2	2005-03-08
High density area array solder microjoining interconnect structure and fabrication method Grant 6,819,000 - Magerlein , et al. November 16, 2	2004-11-16
Internally reinforced bond pads App 20040195642 - Angell, David ; et al.	2004-10-07
Wedgebond Pads Having A Nonplanar Surface Structure App 20040195679 - Petrarca, Kevin Shawn ; et al.	2004-10-07
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same Grant 6,747,472 - Magerlein , et al. June 8, 2	2004-06-08
High density raised stud microjoining system and methods of fabricating the same Grant 6,732,908 - Furman , et al. May 11, 2	2004-05-11
High density area array solder microjoining interconnect structure and fabrication method App 20040084782 - Magerlein, John Harold ; et al.	2004-05-06
High density area array solder microjoining interconnect structure and fabrication method Grant 6,661,098 - Magerlein , et al. December 9, 2	2003-12-09
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same App 20030136813 - Magerlein, John Harold ; et al.	2003-07-24
High density area array solder microjoining interconnect structure and fabrication method App 20030137058 - Magerlein, John Harold ; et al.	2003-07-24
High density raised stud microjoining system and methods of fabricating the same App 20030136814 - Furman, Bruce Kenneth ; et al.	2003-07-24
Modular high frequency integrated circuit structure Grant 6,259,148 - Bartush , et al. July 10, 2	2001-07-10

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