Volant; Richard P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Volant; Richard P..The latest application filed is for "protected through semiconductor via (tsv)".

Company Profile

0.93.83

Volant; Richard P. - Clifton TN
Volant; Richard P. - New Fairfield CT US
Volant; Richard P. - Hopewell Junction NY
Volant; Richard P - New Fairfield CT US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protected through semiconductor via (TSV) Grant 9,673,095 - Farooq , et al. June 6, 2	2017-06-06
Protected Through Semiconductor Via (tsv) App 20160293487 - Farooq; Mukta G. ; et al.	2016-10-06
Protected through semiconductor via (TSV) Grant 9,401,323 - Farooq , et al. July 26, 2	2016-07-26
Yield enhancement for stacked chips through rotationally-connecting-interposer Grant 9,151,781 - Gluschenkov , et al. October 6, 2	2015-10-06
Enhanced capture pads for through semiconductor vias Grant 9,040,418 - Farooq , et al. May 26, 2	2015-05-26
Method And Structure Of Forming Backside Through Silicon Via Connections App 20150097273 - Farooq; Mukta G. ; et al.	2015-04-09
Method and structure of forming backside through silicon via connections Grant 8,970,011 - Farooq , et al. March 3, 2	2015-03-03
Polymeric edge seal for bonded substrates Grant 8,894,800 - Farooq , et al. November 25, 2	2014-11-25
Enhanced capture pads for through semiconductor vias Grant 8,772,949 - Farooq , et al. July 8, 2	2014-07-08
Method And Structure Of Forming Backside Through Silicon Via Connections App 20140124954 - Farooq; Mukta G. ; et al.	2014-05-08
Enhanced Capture Pads For Through Semiconductor Vias App 20140127904 - Farooq; Mukta G. ; et al.	2014-05-08
Enhanced Capture Pads For Through Semiconductor Vias App 20140124946 - Farooq; Mukta G. ; et al.	2014-05-08
Method and structure of forming backside through silicon via connections Grant 8,709,936 - Volant , et al. April 29, 2	2014-04-29
TSV pillar as an interconnecting structure Grant 8,691,691 - Farooq , et al. April 8, 2	2014-04-08
Metal-contamination-free through-substrate via structure Grant 8,679,971 - Farooq , et al. March 25, 2	2014-03-25
Protecting a mold having a substantially planar surface provided with a plurality of mold cavities Grant 8,668,834 - Jones , et al. March 11, 2	2014-03-11
Prevention Of Thru-substrate Via Pistoning Using Highly Doped Copper Alloy Seed Layer App 20140061915 - Collins; Christopher N. ; et al.	2014-03-06
Optimized annular copper TSV Grant 8,658,535 - Andry , et al. February 25, 2	2014-02-25
Method And Structure Of Forming Backside Through Silicon Via Connections App 20140035109 - Volant; Richard P. ; et al.	2014-02-06
Integrated void fill for through silicon via Grant 8,633,580 - Volant , et al. January 21, 2	2014-01-21
Polymeric edge seal for bonded substrates Grant 8,613,996 - Farooq , et al. December 24, 2	2013-12-24
Integrated void fill for through silicon via Grant 8,609,537 - Volant , et al. December 17, 2	2013-12-17
Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation last Grant 8,563,403 - Farooq , et al. October 22, 2	2013-10-22
Alignment marks to enable 3D integration Grant 8,546,961 - Farooq , et al. October 1, 2	2013-10-01
Optimized Annular Copper Tsv App 20130244420 - Andry; Paul S. ; et al.	2013-09-19
Metal-contamination-free through-substrate via structure Grant 8,492,878 - Farooq , et al. July 23, 2	2013-07-23
Optimized annular copper TSV Grant 8,487,425 - Andry , et al. July 16, 2	2013-07-16
Polymeric Edge Seal For Bonded Substrates App 20130168015 - Farooq; Mutka G. ; et al.	2013-07-04
Metal-contamination-free Through-substrate Via Structure App 20130143400 - Farooq; Mukta G. ; et al.	2013-06-06
Integrated void fill for through silicon via Grant 8,455,356 - Volant , et al. June 4, 2	2013-06-04
Integrated Void Fill For Through Silicon Via App 20130122702 - Volant; Richard P. ; et al.	2013-05-16
Method of fabricating coaxial through-silicon via Grant 8,394,715 - Volant , et al. March 12, 2	2013-03-12
Tsv Pillar As An Interconnecting Structure App 20130026606 - Farooq; Mukta G. ; et al.	2013-01-31
Optimized Annular Copper Tsv App 20120326309 - ANDRY; PAUL S ; et al.	2012-12-27
Integrated Void Fill For Through Silicon Via App 20120292786 - Volant; Richard P. ; et al.	2012-11-22
Method Of Fabricating Coaxial Through-silicon Via App 20120258589 - Volant; Richard P. ; et al.	2012-10-11
Protecting A Mold Having A Substantially Planar Surface Provided With A Plurality Of Mold Cavities App 20120207920 - Jones; Bradley P. ; et al.	2012-08-16
Coaxial through-silicon via Grant 8,242,604 - Volant , et al. August 14, 2	2012-08-14
Alignment Marks To Enable 3d Integration App 20120175789 - Farooq; Mukta G. ; et al.	2012-07-12
Yield Enhancement For Stacked Chips Through Rotationally-connecting-interposer App 20120146682 - Gluschenkov; Oleg ; et al.	2012-06-14
Yield enhancement for stacked chips through rotationally-connecting-interposer Grant 8,159,247 - Gluschenkov , et al. April 17, 2	2012-04-17
Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip Grant 8,114,707 - Farooq , et al. February 14, 2	2012-02-14
Metal-contamination-free Through-substrate Via Structure App 20120018851 - Farooq; Mukta G. ; et al.	2012-01-26
Method Of Forming A Multi-chip Stacked Structure Including A Thin Interposer Chip Having A Face-to-back Bonding With Another Chip App 20110237026 - Farooq; Mukta G. ; et al.	2011-09-29
Integrated Void Fill For Through Silicon Via App 20110175216 - Volant; Richard P. ; et al.	2011-07-21
Coaxial Through-silicon Via App 20110095435 - Volant; Richard P. ; et al.	2011-04-28
Polymeric Edge Seal For Bonded Substrates App 20110091685 - Farooq; Mukta G. ; et al.	2011-04-21
Forming A Protective Layer On A Mold And Mold Having A Protective Layer App 20110079702 - Jones; Bradley P. ; et al.	2011-04-07
Yield Enhancement For Stacked Chips Through Rotationally-connecting-interposer App 20110080189 - Gluschenkov; Oleg ; et al.	2011-04-07
Method of fabricating a high Q factor integrated circuit inductor Grant 7,829,427 - Edelstein , et al. November 9, 2	2010-11-09
Solder connector structure and method Grant 7,816,248 - Farooq , et al. October 19, 2	2010-10-19
Micro-electromechanical sub-assembly having an on-chip transfer mechanism Grant 7,735,216 - Schnabel , et al. June 15, 2	2010-06-15
Structure and method for self aligned vertical plate capacitor Grant 7,670,921 - Chinthakindi , et al. March 2, 2	2010-03-02
Method Of Fabricating A High Q Factor Integrated Circuit Inductor App 20100047990 - Edelstein; Daniel C. ; et al.	2010-02-25
Method of fabricating a high Q factor integrated circuit inductor Grant 7,638,406 - Edelstein , et al. December 29, 2	2009-12-29
Semiconductor device structures with backside contacts for improved heat dissipation and reduced parasitic resistance Grant 7,622,357 - Vaed , et al. November 24, 2	2009-11-24
Suspended transmission line structures in back end of line processing Grant 7,608,909 - Chinthakindi , et al. October 27, 2	2009-10-27
Apparatus for accurate and efficient quality and reliability evaluation of micro electromechanical systems Grant 7,602,265 - Deligianni , et al. October 13, 2	2009-10-13
Method of forming noble metal contacts Grant 7,581,314 - Deligianni , et al. September 1, 2	2009-09-01
Method of forming a bond pad on an I/C chip and resulting structure Grant 7,572,726 - Biggs , et al. August 11, 2	2009-08-11
Integration Scheme For Extension Of Via Opening Depth App 20090181532 - Colon; David P. ; et al.	2009-07-16
Planar vertical resistor and bond pad resistor and related method Grant 7,528,048 - Coolbaugh , et al. May 5, 2	2009-05-05
Micro-electromechanical Sub-assembly Having An On-chip Transfer Mechanism App 20090019691 - Schnabel; Christopher M. ; et al.	2009-01-22
Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environment Grant 7,480,538 - Volant , et al. January 20, 2	2009-01-20
Solder connector structure and method Grant 7,470,985 - Farooq , et al. December 30, 2	2008-12-30
System And Methods For Managing Process Flow Changes App 20080319565 - Colon; David P. ; et al.	2008-12-25
Bipolar transistor having self-aligned silicide and a self-aligned emitter contact border Grant 7,466,010 - Ahlgren , et al. December 16, 2	2008-12-16
Method And System For Automated Resource Management And Optimization App 20080306797 - Fayaz; Mohammed F. ; et al.	2008-12-11
Solder Connector Structure And Method App 20080248643 - Farooq; Mukta G. ; et al.	2008-10-09
Methods, Systems, And Computer Program Products For Managing Movement Of Work-in-process Materials In An Automated Manufacturing Environment App 20080167733 - Volant; Richard P. ; et al.	2008-07-10
Methods, Systems, And Computer Program Products For Managing Movement Of Work-in-process Materials In An Automated Manufacturing Environment App 20080167743 - Volant; Richard P. ; et al.	2008-07-10
Direct Termination Of A Wiring Metal In A Semiconductor Device App 20080157382 - Chinthakindi; Anil K. ; et al.	2008-07-03
Structure And Method For Self Aligned Vertical Plate Capacitor App 20080158771 - Chinthakindi; Anil K. ; et al.	2008-07-03
Planar vertical resistor and bond pad resistor Grant 7,394,110 - Coolbaugh , et al. July 1, 2	2008-07-01
Planar Vertical Resistor And Bond Pad Resistor And Related Method App 20080132027 - Coolbaugh; Douglas D. ; et al.	2008-06-05
Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environment Grant 7,369,911 - Volant , et al. May 6, 2	2008-05-06
Flexible assembly of stacked chips Grant 7,355,271 - Volant , et al. April 8, 2	2008-04-08
Solder Connector Structure And Method App 20080023827 - Farooq; Mukta G. ; et al.	2008-01-31
Semiconductor Device Structures With Backside Contacts For Improved Heat Dissipation And Reduced Parasitic Resistance App 20070275533 - Vaed; Kunal ; et al.	2007-11-29
Forming of high aspect ratio conductive structure using injection molded solder Grant 7,273,806 - Groves , et al. September 25, 2	2007-09-25
Diaphragm activated micro-electromechanical switch Grant 7,256,670 - Jahnes , et al. August 14, 2	2007-08-14
Planar Vertical Resistor And Bond Pad Resistor And Related Method App 20070181974 - Coolbaugh; Douglas D. ; et al.	2007-08-09
Single Or Dual Damascene Via Level Wirings And/or Devices, And Methods Of Fabricating Same App 20070152332 - Chinthakindi; Anil K. ; et al.	2007-07-05
Apparatus For Accurate And Efficient Quality And Reliability Evaluation Of Micro Electromechanical Systems App 20070090902 - Deligianni; Hariklia ; et al.	2007-04-26
Noble metal contacts for micro-electromechanical switches Grant 7,202,764 - Deligianni , et al. April 10, 2	2007-04-10
Flexible assembly of stacked chips App 20070059951 - Volant; Richard P. ; et al.	2007-03-15
Method For Forming Suspended Transmission Line Structures In Back End Of Line Processing App 20060197119 - Chinthakindi; Anil K. ; et al.	2006-09-07
Noble metal contacts for micro-electromechanical switches App 20060164194 - Deligianni; Hariklia ; et al.	2006-07-27
High Q factor integrated circuit inductor Grant 7,068,138 - Edelstein , et al. June 27, 2	2006-06-27
Forming Of High Aspect Ratio Conductive Structure Using Injection Molded Solder App 20060124927 - Groves; Robert A. ; et al.	2006-06-15
Multi-level RF passive device Grant 7,053,460 - Volant , et al. May 30, 2	2006-05-30
High Q factor integrated circuit inductor App 20060105534 - Edelstein; Daniel C. ; et al.	2006-05-18
Method of forming a bond pad on an I/C chip and resulting structure App 20060081981 - Biggs; Julie C. ; et al.	2006-04-20
Method of forming suspended transmission line structures in back end of line processing Grant 7,005,371 - Chinthakindi , et al. February 28, 2	2006-02-28
I/C chip suitable for wire bonding Grant 6,995,475 - Biggs , et al. February 7, 2	2006-02-07
Damascene integration scheme for developing metal-insulator-metal capacitors Grant 6,992,344 - Coolbaugh , et al. January 31, 2	2006-01-31
Production of metal insulator metal (MIM) structures using anodizing process Grant 6,992,368 - Volant , et al. January 31, 2	2006-01-31
Diaphragm activated micro-electromechanical switch App 20060017533 - Jahnes; Christopher V. ; et al.	2006-01-26
Bipolar transistor having self-aligned silicide and a self-aligned emitter contact border Grant 6,979,884 - Ahlgren , et al. December 27, 2	2005-12-27
Method For Forming Suspended Transmission Line Structures In Back End Of Line Processing App 20050245063 - Chinthakindi, Anil K. ; et al.	2005-11-03
Bipolar transistor having self-aligned silicide and a self-aligned emitter contact border App 20050242373 - Ahlgren, David C. ; et al.	2005-11-03
Method for BEOL resistor tolerance improvement using anodic oxidation Grant 6,933,186 - Cotte , et al. August 23, 2	2005-08-23
Fuse structure and method to form the same Grant 6,927,472 - Anderson , et al. August 9, 2	2005-08-09
High Q factor integrated circuit inductor App 20050167780 - Edelstein, Daniel C. ; et al.	2005-08-04
Fuse structure and method to form the same Grant 6,924,185 - Anderson , et al. August 2, 2	2005-08-02
Bipolar transistor having self-aligned silicide and a self-aligned emitter contact border App 20050121748 - Ahlgren, David C. ; et al.	2005-06-09
Encapsulated energy-dissipative fuse for integrated circuits and method of making the same Grant 6,873,027 - Dalton , et al. March 29, 2	2005-03-29
Method of forming a bond pad on an I/C chip and resulting structure App 20050062170 - Biggs, Julie C. ; et al.	2005-03-24
Noble Metal Contacts For Micro-electromechanical Switches App 20050007217 - Deligianni, Hariklia ; et al.	2005-01-13
Check valve for micro electro mechanical structure devices Grant 6,834,671 - Cotte , et al. December 28, 2	2004-12-28
Micro-electromechanical switch having a conductive compressible electrode Grant 6,836,029 - Greenberg , et al. December 28, 2	2004-12-28
Micro-electromechanical inductive switch Grant 6,831,542 - Volant , et al. December 14, 2	2004-12-14
Structure and method for reducing thermo-mechanical stress in stacked vias Grant 6,831,363 - Dalton , et al. December 14, 2	2004-12-14
Method of fabricating MIM capacitor with the encapsulated metal structure serving as the lower plate Grant 6,825,075 - Petrarca , et al. November 30, 2	2004-11-30
Self-contained heat sink and a method for fabricating same Grant 6,815,813 - Dalton , et al. November 9, 2	2004-11-09
Method of fabricating micro-electromechanical switches on CMOS compatible substrates Grant 6,798,029 - Volant , et al. September 28, 2	2004-09-28
Micro-electromechanical Inductive Switch App 20040164825 - Volant, Richard P. ; et al.	2004-08-26
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same App 20040147089 - Petrarca, Kevin S. ; et al.	2004-07-29
Check valve for micro electro mechanical structure devices App 20040134538 - Cotte, John Michael ; et al.	2004-07-15
Micro electromechanical switch having self-aligned spacers Grant 6,762,667 - Volant , et al. July 13, 2	2004-07-13
Method Of Fabricating Micro-electromechanical Switches On Cmos Compatible Substrates App 20040126921 - Volant, Richard P. ; et al.	2004-07-01
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Grant 6,756,624 - Petrarca , et al. June 29, 2	2004-06-29
Structure and method for reducing thermo-mechanical stress in stacked vias App 20040113278 - Dalton, Timothy J. ; et al.	2004-06-17
Damascene integration scheme for developing metal-insulator-metal capacitors App 20040113235 - Coolbaugh, Douglas D. ; et al.	2004-06-17
Fuse structure and method to form the same App 20040070049 - Anderson, David K. ; et al.	2004-04-15
Perpendicular torsion micro-electromechanical switch Grant 6,701,779 - Volant , et al. March 9, 2	2004-03-09
Micro-electromechanical varactor with enhanced tuning range Grant 6,696,343 - Chinthakindi , et al. February 24, 2	2004-02-24
Micro-electromechanical varactor with enhanced tuning range Grant 6,661,069 - Chinthakindi , et al. December 9, 2	2003-12-09
Method for fabricating a scanning probe microscope probe Grant 6,656,369 - Krishnan , et al. December 2, 2	2003-12-02
Process of providing a semiconductor device with electrical interconnection capability Grant 6,653,233 - Cotte , et al. November 25, 2	2003-11-25
Micro electromechanical switch having self-aligned spacers App 20030210124 - Volant, Richard P. ; et al.	2003-11-13
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same App 20030211698 - Petrarca, Kevin S. ; et al.	2003-11-13
Production of metal insulator metal (MIM) structures using anodizing process App 20030203586 - Volant, Richard P. ; et al.	2003-10-30
Method of fabricating micro-electromechanical switches on CMOS compatible substrates Grant 6,635,506 - Volant , et al. October 21, 2	2003-10-21
Perpendicular torsion micro-electromechanical switch App 20030178635 - Volant, Richard P. ; et al.	2003-09-25
Electromechanical device and a process of preparing same Grant 6,622,507 - Cotte , et al. September 23, 2	2003-09-23
Micro electromechanical switch having self-aligned spacers Grant 6,621,392 - Volant , et al. September 16, 2	2003-09-16
Production of metal insulator metal (MIM) structures using anodizing process Grant 6,613,641 - Volant , et al. September 2, 2	2003-09-02
Method Of Fabricating Micro-electromechanical Switches On Cmos Compatible Substrates App 20030148550 - Volant, Richard P. ; et al.	2003-08-07
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Grant 6,597,068 - Petrarca , et al. July 22, 2	2003-07-22
Method for fabricating a scanning probe microscope probe App 20030132191 - Krishnan, Mahadevaiyer ; et al.	2003-07-17
Multi-level RF passive device App 20030116850 - Volant, Richard P. ; et al.	2003-06-26
Micro-electromechanical switch having a conductive compressible electrode App 20030098618 - Greenberg, David R. ; et al.	2003-05-29
Fuse structure and method to form the same App 20030089962 - Anderson, David K. ; et al.	2003-05-15
Common ball-limiting metallurgy for I/O sites App 20030092254 - Walker, George F. ; et al.	2003-05-15
Encapsulated energy-dissipative fuse for integrated circuits and method of making the same App 20030080393 - Dalton, Timothy J. ; et al.	2003-05-01
Method for BEOL resistor tolerance improvement using anodic oxidation App 20030059992 - Cotte, John M. ; et al.	2003-03-27
Common ball-limiting metallurgy for I/O sites Grant 6,534,863 - Walker , et al. March 18, 2	2003-03-18
Electromechanical device and a process of preparing same App 20030019540 - Cotte, John Michael ; et al.	2003-01-30
Check valve for micro electro mechanical structure devices App 20030019528 - Cotte, John Michael ; et al.	2003-01-30
Process of providing a semiconductor device with electrical interconnection capability App 20030003746 - Cotte, John Michael ; et al.	2003-01-02
Common ball-limiting metallurgy for I/O sites App 20020111010 - Walker, George F. ; et al.	2002-08-15
Process for removing chemical mechanical polishing residual slurry Grant 6,425,956 - Cotte , et al. July 30, 2	2002-07-30
Process For Removing Chemical Mechanical Polishing Residual Slurry App 20020088477 - Cotte, John Michael ; et al.	2002-07-11
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same App 20020068431 - Petrarca, Kevin S. ; et al.	2002-06-06
Method of forming a crack stop structure and diffusion barrier in integrated circuits Grant 6,383,893 - Begle , et al. May 7, 2	2002-05-07
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same Grant 6,368,953 - Petrarca , et al. April 9, 2	2002-04-09
Selective plating process Grant 6,368,484 - Volant , et al. April 9, 2	2002-04-09
Pattern-sensitive electrolytic metal plating Grant 6,344,125 - Locke , et al. February 5, 2	2002-02-05

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