Vodrahalli; Nagesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vodrahalli; Nagesh.The latest application filed is for "memory scaling semiconductor device".

Company Profile

3.18.9

Vodrahalli; Nagesh - Los Altos CA
Vodrahalli; Nagesh - Phoenix AZ
Vodrahalli; Nagesh - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Memory scaling semiconductor device Grant 11,444,062 - Vodrahalli September 13, 2	2022-09-13
Microwave integrated quantum circuits with cap wafers and their methods of manufacture Grant 11,121,301 - Marshall , et al. September 14, 2	2021-09-14
Memory scaling semiconductor device Grant 11,094,674 - Vodrahalli , et al. August 17, 2	2021-08-17
Memory Scaling Semiconductor Device App 20210249385 - Vodrahalli; Nagesh	2021-08-12
Memory scaling semiconductor device Grant 11,011,500 - Vodrahalli , et al. May 18, 2	2021-05-18
Memory scaling semiconductor device Grant 11,004,829 - Vodrahalli May 11, 2	2021-05-11
Substrate materials for quantum processors Grant 10,985,308 - Vodrahalli April 20, 2	2021-04-20
Memory Scaling Semiconductor Device App 20210104494 - Vodrahalli; Nagesh ; et al.	2021-04-08
Memory Scaling Semiconductor Device App 20210104495 - Vodrahalli; Nagesh ; et al.	2021-04-08
Memory Scaling Semiconductor Device App 20210104493 - Vodrahalli; Nagesh	2021-04-08
TSV semiconductor device including two-dimensional shift Grant 10,811,392 - Hirano , et al. October 20, 2	2020-10-20
Tsv Semiconductor Device Including Two-dimensional Shift App 20200273844 - Hirano; Toshiki ; et al.	2020-08-27
Substrate materials for quantum processors Grant 10,535,809 - Vodrahalli Ja	2020-01-14
Method and apparatus for testing a flip-chip assembly during manufacture Grant 9,870,959 - Vodrahalli January 16, 2	2018-01-16
Method and apparatus for testing integrated circuit die with a partially completed and validated module Grant 9,201,097 - Vodrahalli December 1, 2	2015-12-01
Electronic assembly apparatus and associated methods Grant 9,040,348 - Vodrahalli , et al. May 26, 2	2015-05-26
Process for assembling an integrated circuit package having a substrate vent hole Grant RE44,629 - Ramalingam , et al. December 10, 2	2013-12-10
Electronic Assembly Apparatus And Associated Methods App 20130069230 - Vodrahalli; Nagesh	2013-03-21
Electronic Assembly Apparatus And Associated Methods App 20130071969 - Vodrahalli; Nagesh ; et al.	2013-03-21
Electronic assembly comprising solderable thermal interface and methods of manufacture Grant 7,091,063 - Sur , et al. August 15, 2	2006-08-15
High performance thermal interface curing process for organic flip chip packages Grant 6,982,192 - Vodrahalli , et al. January 3, 2	2006-01-03
Electronic assembly comprising solderable thermal interface Grant 6,724,078 - Sur , et al. April 20, 2	2004-04-20
Integrated circuit package having a substrate vent hole Grant 6,490,166 - Ramalingam , et al. December 3, 2	2002-12-03

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