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Patent applications and USPTO patent grants for Vo; Vu T..The latest application filed is for "stacked printed circuit board packages".
Patent | Date |
---|---|
Stacked printed circuit board packages Grant 10,631,410 - Provencher , et al. | 2020-04-21 |
Low-profile space-efficient shielding for SIP module Grant 10,624,214 - Salehi , et al. | 2020-04-14 |
Stacked Printed Circuit Board Packages App 20180092213 - Provencher; Corey S. ;   et al. | 2018-03-29 |
Low-profile Space-efficient Shielding For Sip Module App 20160270213 - Salehi; Amir ;   et al. | 2016-09-15 |
Printed circuit board sensor mounting and alignment Grant 8,194,410 - DiCarlo , et al. June 5, 2 | 2012-06-05 |
Printed Circuit Board Sensor Mounting And Alignment App 20110242776 - DiCarlo; Derek J. ;   et al. | 2011-10-06 |
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