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Patent applications and USPTO patent grants for Vivares; Valerie.The latest application filed is for "molded semiconductor package with mold surface modification".
Patent | Date |
---|---|
Molded Semiconductor Package with Mold Surface Modification App 20200294877 - Vivares; Valerie ;   et al. | 2020-09-17 |
Semiconductor Device, Method for Fabricating a Semiconductor Device and Method for Reinforcing a Die in a Semiconductor Device App 20180218992 - Vivares; Valerie ;   et al. | 2018-08-02 |
Design tool for integrated circuit design Grant 6,983,438 - Newman , et al. January 3, 2 | 2006-01-03 |
Laser trim process control Grant 6,621,043 - Lambert , et al. September 16, 2 | 2003-09-16 |
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