| Patent | Date |
|---|
Packaged dies with metal outer layers extending from die back sides toward die front sides
Grant 11,437,276 - Molla , et al. September 6, 2 | 2022-09-06 |
Methods Of Fabricating Leadless Power Amplifier Packages Including Topside Terminations
App 20220238450 - Wei; Yun ; et al. | 2022-07-28 |
Leadless power amplifier packages including topside terminations and methods for the fabrication thereof
Grant 11,342,275 - Wei , et al. May 24, 2 | 2022-05-24 |
Packaged electronic devices with top terminations
Grant 11,343,919 - Santos , et al. May 24, 2 | 2022-05-24 |
Leadless Power Amplifier Packages Including Topside Terminations And Methods For The Fabrication Thereof
App 20220130768 - Wei; Yun ; et al. | 2022-04-28 |
Hybrid Device Assemblies And Method Of Fabrication
App 20220130785 - Li; Li ; et al. | 2022-04-28 |
Substrate With Thermal Vias And Sinter-bonded Thermal Dissipation Structure
App 20220068817 - LI; Lu ; et al. | 2022-03-03 |
Power amplifier devices containing frontside heat extraction structures and methods for the fabrication thereof
Grant 11,196,390 - Mares , et al. December 7, 2 | 2021-12-07 |
Power Amplifier Devices Containing Frontside Heat Extraction Structures And Methods For The Fabrication Thereof
App 20210336585 - Mares; Edward Christian ; et al. | 2021-10-28 |
Power Amplifier Modules Including Topside Cooling Interfaces And Methods For The Fabrication Thereof
App 20210328552 - Tucker; Geoffrey ; et al. | 2021-10-21 |
Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof
Grant 11,128,268 - Kishore , et al. September 21, 2 | 2021-09-21 |
Internally-shielded microelectronic packages and methods for the fabrication thereof
Grant 10,861,774 - Sanchez , et al. December 8, 2 | 2020-12-08 |
Microelectronic components having integrated heat dissipation posts and systems including the same
Grant 10,861,764 - Viswanathan , et al. December 8, 2 | 2020-12-08 |
Semiconductor device package and methods of manufacture thereof
Grant 10,825,747 - Li , et al. November 3, 2 | 2020-11-03 |
Thick-silver Layer Interface
App 20200335420 - Viswanathan; Lakshminarayan ; et al. | 2020-10-22 |
Packaged Dies With Metal Outer Layers Extending From Die Back Sides Toward Die Front Sides
App 20200335398 - Molla; Jaynal A. ; et al. | 2020-10-22 |
Power Amplifier Packages And Systems Incorporating Design-flexible Package Platforms
App 20200328721 - Nanan; Jean-Christophe ; et al. | 2020-10-15 |
Packaged microelectronic component mounting using sinter attachment
Grant 10,806,021 - Viswanathan , et al. October 13, 2 | 2020-10-13 |
Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
Grant 10,785,862 - Viswanathan , et al. Sept | 2020-09-22 |
Method of wafer dicing for wafers with backside metallization and packaged dies
Grant 10,741,446 - Molla , et al. A | 2020-08-11 |
Thick-silver layer interface
Grant 10,727,153 - Viswanathan , et al. | 2020-07-28 |
Internally-shielded Microelectronic Packages And Methods For The Fabrication Thereof
App 20200211932 - SANCHEZ; AUDEL ; et al. | 2020-07-02 |
Internally-shielded microelectronic packages and methods for the fabrication thereof
Grant 10,629,518 - Sanchez , et al. | 2020-04-21 |
Internally-shielded Microelectronic Packages And Methods For The Fabrication Thereof
App 20200075463 - SANCHEZ; AUDEL ; et al. | 2020-03-05 |
Semiconductor package design providing reduced electromagnetic coupling between circuit components
Grant 10,573,594 - Aaen , et al. Feb | 2020-02-25 |
Molded air cavity packages and methods for the production thereof
Grant 10,529,638 - Sanchez , et al. J | 2020-01-07 |
Electromagnetically-shielded microelectronic assemblies and methods for the fabrication thereof
Grant 10,506,704 - Embar , et al. Dec | 2019-12-10 |
Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
Grant 10,485,091 - Molla , et al. Nov | 2019-11-19 |
Methods Of Manufacturing Packaged Electronic Devices With Top Terminations
App 20190343005 - Santos; Fernando A. ; et al. | 2019-11-07 |
Packaged Microelectronic Component Mounting Using Sinter Attachment
App 20190342988 - Viswanathan; Lakshminarayan ; et al. | 2019-11-07 |
Microelectronic modules including thermal extension levels and methods for the fabrication thereof
Grant 10,440,813 - Li , et al. O | 2019-10-08 |
Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof
Grant 10,431,449 - Molla , et al. O | 2019-10-01 |
Packaged microelectronic component mounting using sinter attachment
Grant 10,405,417 - Viswanathan , et al. Sep | 2019-09-03 |
Molded air cavity packages and methods for the production thereof
Grant 10,396,006 - Sanchez , et al. A | 2019-08-27 |
Methods of manufacturing packaged electronic devices with top terminations
Grant 10,375,833 - Viswanathan , et al. | 2019-08-06 |
Microelectronic Components Having Integrated Heat Dissipation Posts And Systems Including The Same
App 20190206759 - Viswanathan; Lakshminarayan ; et al. | 2019-07-04 |
Microelectronic Systems Containing Embedded Heat Dissipation Structures And Methods For The Fabrication Thereof
App 20190148138 - MOLLA; JAYNAL A. ; et al. | 2019-05-16 |
Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
Grant 10,269,678 - Viswanathan , et al. | 2019-04-23 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190109060 - SANCHEZ; AUDEL ; et al. | 2019-04-11 |
Microelectronic Modules With Sinter-bonded Heat Dissipation Structures And Methods For The Fabrication Thereof
App 20190098743 - MOLLA; JAYNAL A. ; et al. | 2019-03-28 |
High power semiconductor package subsystems
Grant 10,211,177 - Viswanathan , et al. Feb | 2019-02-19 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190051571 - SANCHEZ; AUDEL ; et al. | 2019-02-14 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190043775 - SANCHEZ; AUDEL ; et al. | 2019-02-07 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190043774 - SANCHEZ; AUDEL ; et al. | 2019-02-07 |
Molded air cavity packages and methods for the production thereof
Grant 10,199,303 - Sanchez , et al. Fe | 2019-02-05 |
Molded air cavity packages and methods for the production thereof
Grant 10,199,302 - Sanchez , et al. Fe | 2019-02-05 |
Microelectronic Modules With Sinter-bonded Heat Dissipation Structures And Methods For The Fabrication Thereof
App 20190021162 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2019-01-17 |
Method Of Wafer Dicing For Wafers With Backside Metallization And Packaged Dies
App 20190013242 - Molla; Jaynal A. ; et al. | 2019-01-10 |
Radio frequency (RF) devices
Grant 10,147,698 - Viswanathan , et al. De | 2018-12-04 |
Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof
Grant 10,141,182 - Molla , et al. Nov | 2018-11-27 |
Packaged Microelectronic Component Mounting Using Sinter Attachment
App 20180317312 - Viswanathan; Lakshminarayan ; et al. | 2018-11-01 |
Semiconductor device with an isolation structure coupled to a cover of the semiconductor device
Grant 10,109,594 - Viswanathan , et al. October 23, 2 | 2018-10-23 |
Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
Grant 10,104,759 - Viswanathan , et al. October 16, 2 | 2018-10-16 |
Packaged Electronic Devices With Top Terminations, And Methods Of Manufacture Thereof
App 20180270960 - VISWANATHAN; Lakshminarayan ; et al. | 2018-09-20 |
Semiconductor devices with a thermally conductive layer and methods of their fabrication
Grant 10,074,588 - Viswanathan , et al. September 11, 2 | 2018-09-11 |
Microelectronic Modules With Sinter-bonded Heat Dissipation Structures And Methods For The Fabrication Thereof
App 20180153030 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2018-05-31 |
Packaged electronic devices with top terminations, and methods of manufacture thereof
Grant 9,986,646 - Viswanathan , et al. May 29, 2 | 2018-05-29 |
Sintered multilayer heat sinks for microelectronic packages and methods for the production thereof
Grant 9,984,951 - Viswanathan May 29, 2 | 2018-05-29 |
Semiconductor devices with protruding conductive vias and methods of making such devices
Grant 9,941,210 - Viswanathan , et al. April 10, 2 | 2018-04-10 |
Air Cavity Packages And Methods For The Production Thereof
App 20180082915 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2018-03-22 |
Air cavity packages and methods for the production thereof
Grant 9,922,894 - Viswanathan , et al. March 20, 2 | 2018-03-20 |
Sintered Multilayer Heat Sinks For Microelectronic Packages And Methods For The Production Thereof
App 20180033716 - VISWANATHAN; LAKSHMINARAYAN | 2018-02-01 |
Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
Grant 9,875,987 - Viswanathan , et al. January 23, 2 | 2018-01-23 |
Flexible Circuit Leads In Packaging For Radio Frequency Devices And Methods Thereof
App 20180019222 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2018-01-18 |
Semiconductor Device Package And Methods Of Manufacture Thereof
App 20180012815 - LI; LI ; et al. | 2018-01-11 |
Semiconductor device packages
Grant 9,837,328 - Viswanathan December 5, 2 | 2017-12-05 |
Methods for forming semiconductor device packages
Grant 9,837,327 - Viswanathan December 5, 2 | 2017-12-05 |
Flexible circuit leads in packaging for radio frequency devices
Grant 9,824,995 - Viswanathan , et al. November 21, 2 | 2017-11-21 |
Semiconductor device package and methods of manufacture thereof
Grant 9,799,580 - Li , et al. October 24, 2 | 2017-10-24 |
Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
Grant 9,800,208 - Shah , et al. October 24, 2 | 2017-10-24 |
Semiconductor Device Package And Methods Of Manufacture Thereof
App 20170278763 - LI; Li ; et al. | 2017-09-28 |
High Power Semiconductor Package Subsystems
App 20170271292 - Viswanathan; Lakshminarayan ; et al. | 2017-09-21 |
Thick-silver Layer Interface
App 20170263529 - Viswanathan; Lakshminarayan ; et al. | 2017-09-14 |
Semiconductor devices with impedance matching-circuits
Grant 9,748,185 - Viswanathan , et al. August 29, 2 | 2017-08-29 |
Semiconductor Devices with a Thermally Conductive Layer and Methods of Their Fabrication
App 20170207142 - Viswanathan; Lakshminarayan ; et al. | 2017-07-20 |
Thick-silver layer interface for a semiconductor die and corresponding thermal layer
Grant 9,698,116 - Viswanathan , et al. July 4, 2 | 2017-07-04 |
High power semiconductor package subsystems
Grant 9,673,162 - Viswanathan , et al. June 6, 2 | 2017-06-06 |
Semiconductor devices with a thermally conductive layer
Grant 9,614,046 - Viswanathan , et al. April 4, 2 | 2017-04-04 |
Electronic devices with semiconductor die coupled to a thermally conductive substrate
Grant 9,589,860 - Viswanathan , et al. March 7, 2 | 2017-03-07 |
Solder wettable flanges and devices and systems incorporating solder wettable flanges
Grant 9,538,659 - Viswanathan , et al. January 3, 2 | 2017-01-03 |
Electronic Devices With Attached Die Structures And Methods Of Formation Of Such Devices
App 20160365323 - Viswanathan; Lakshminarayan ; et al. | 2016-12-15 |
Radiation devices
Grant 9,518,555 - Bokatius , et al. December 13, 2 | 2016-12-13 |
Semiconductor devices, semiconductor device packages, and packaging techniques for impedance matching and/or low frequency terminations
Grant 9,484,222 - Ladhani , et al. November 1, 2 | 2016-11-01 |
Semiconductor Devices With A Thermally Conductive Layer
App 20160308010 - Viswanathan; Lakshminarayan ; et al. | 2016-10-20 |
Semiconductor Device Packages
App 20160293508 - Viswanathan; Lakshminarayan | 2016-10-06 |
Methods For Forming Semiconductor Device Packages
App 20160293568 - Viswanathan; Lakshminarayan | 2016-10-06 |
Semiconductor device with mechanical lock features between a semiconductor die and a substrate
Grant 9,425,161 - Viswanathan , et al. August 23, 2 | 2016-08-23 |
Semiconductor Package Design Providing Reduced Electromagnetic Coupling Between Circuit Components
App 20160225713 - Aaen; Peter H. ; et al. | 2016-08-04 |
Semiconductor Devices With Impedance Matching-circuits
App 20160172318 - Viswanathan; Lakshminarayan ; et al. | 2016-06-16 |
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package
App 20160163623 - Viswanathan; Lakshminarayan ; et al. | 2016-06-09 |
Radio Frequency Devices With Surface-mountable Capacitors For Decoupling And Methods Thereof
App 20160164471 - SHAH; Mahesh K. ; et al. | 2016-06-09 |
Radiation Devices
App 20160160833 - Bokatius; Mario M. ; et al. | 2016-06-09 |
Semiconductor devices with a thermally conductive layer and methods of their fabrication
Grant 9,362,198 - Viswanathan , et al. June 7, 2 | 2016-06-07 |
Packaged Electronic Devices With Top Terminations, And Methods Of Manufacture Thereof
App 20160150632 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2016-05-26 |
Thick-silver Layer Interface
App 20160126206 - Viswanathan; Lakshminarayan ; et al. | 2016-05-05 |
Semiconductor package design providing reduced electromagnetic coupling between circuit components
Grant 9,312,817 - Aaen , et al. April 12, 2 | 2016-04-12 |
Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
Grant 9,312,231 - Viswanathan April 12, 2 | 2016-04-12 |
Electronic Devices With Solderable Die Structures And Methods Of Formation Of Such Devices
App 20160099199 - Viswanathan; Lakshminarayan ; et al. | 2016-04-07 |
Flexible Circuit Leads In Packaging For Radio Frequency Devices And Methods Thereof
App 20160093587 - VISWANATHAN; Lakshminarayan ; et al. | 2016-03-31 |
Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
Grant 9,300,254 - Shah , et al. March 29, 2 | 2016-03-29 |
Semiconductor devices with impedance matching-circuits
Grant 9,281,283 - Viswanathan , et al. March 8, 2 | 2016-03-08 |
System, method and apparatus for leadless surface mounted semiconductor package
Grant 9,263,375 - Viswanathan , et al. February 16, 2 | 2016-02-16 |
Radio Frequency Devices With Surface-mountable Capacitors For Decoupling And Methods Thereof
App 20150381117 - SHAH; Mahesh K. ; et al. | 2015-12-31 |
Semiconductor Device With Mechanical Lock Features Between A Semiconductor Die And A Substrate
App 20150333031 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2015-11-19 |
Semiconductor Devices With A Thermally Conductive Layer And Methods Of Their Fabrication
App 20150294921 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2015-10-15 |
Packaged leadless semiconductor device
Grant 9,159,588 - Sanchez , et al. October 13, 2 | 2015-10-13 |
Packaged Leadless Semiconductor Device
App 20150249021 - Sanchez; Audel A. ; et al. | 2015-09-03 |
Semiconductor Devices, Semiconductor Device Packages, And Packaging Techniques For Impedance Matching And/or Low Frequency Terminations
App 20150235933 - Ladhani; Hussain H. ; et al. | 2015-08-20 |
Methods for bonding a die and a substrate
Grant 9,111,901 - Jang , et al. August 18, 2 | 2015-08-18 |
Semiconductor devices that include a die bonded to a substrate with a gold interface layer
Grant 9,105,599 - Jang , et al. August 11, 2 | 2015-08-11 |
Packaged semiconductor devices and methods of their fabrication
Grant 9,099,567 - Viswanathan , et al. August 4, 2 | 2015-08-04 |
Method And Apparatus For Multi-chip Structure Semiconductor Package
App 20150171057 - SANTOS; FERNANDO A. ; et al. | 2015-06-18 |
Packaged Semiconductor Devices And Methods Of Their Fabrication
App 20150146399 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2015-05-28 |
Method And Structure For Inhibiting Dendrite Formation
App 20150116961 - Viswanathan; Lakshminarayan | 2015-04-30 |
Method And Apparatus For High Temperature Semiconductor Device Packages And Structures Using A Low Temperature Process
App 20150115451 - VISWANATHAN; LAKSHMINARAYAN | 2015-04-30 |
Solder Wettable Flanges And Devices And Systems Incorporating Solder Wettable Flanges
App 20150055310 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2015-02-26 |
Method and apparatus for multi-chip structure semiconductor package
Grant 8,963,305 - Santos , et al. February 24, 2 | 2015-02-24 |
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package
App 20140332941 - Viswanathan; Lakshminarayan ; et al. | 2014-11-13 |
Semiconductor Devices That Include A Die Bonded To A Substrate With A Gold Interface Layer
App 20140252586 - JANG; JIN-WOOK ; et al. | 2014-09-11 |
Methods For Bonding A Die And A Substrate
App 20140256091 - JANG; JIN-WOOK ; et al. | 2014-09-11 |
System, method and apparatus for leadless surface mounted semiconductor package
Grant 8,803,302 - Viswanathan , et al. August 12, 2 | 2014-08-12 |
Die bonding a semiconductor device
Grant 8,753,983 - Jang , et al. June 17, 2 | 2014-06-17 |
Packaged leadless semiconductor device
Grant 8,698,291 - Sanchez , et al. April 15, 2 | 2014-04-15 |
Method And Apparatus For Multi-chip Structure Semiconductor Package
App 20140084432 - Santos; Fernando A. ; et al. | 2014-03-27 |
High Power Semiconductor Package Subsystems
App 20140070397 - Viswanathan; Lakshminarayan ; et al. | 2014-03-13 |
Semiconductor Devices With Impedance Matching-circuits, And Methods Of Manufacture Thereof
App 20140070365 - Viswanathan; Lakshminarayan ; et al. | 2014-03-13 |
Semiconductor Package Design Providing Reduced Electromagnetic Coupling Between Circuit Components
App 20140022020 - Aaen; Peter H. ; et al. | 2014-01-23 |
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package
App 20130320515 - Viswanathan; Lakshminarayan ; et al. | 2013-12-05 |
Packaged Leadless Semiconductor Device
App 20130154068 - Sanchez; Audel A. ; et al. | 2013-06-20 |
Method of making a mounted gallium nitride device
Grant 8,318,545 - Abdo , et al. November 27, 2 | 2012-11-27 |
Method Of Making A Mounted Gallium Nitride Device
App 20110180808 - Abdo; David F. ; et al. | 2011-07-28 |
Die Bonding A Semiconductor Device
App 20110163439 - Jang; Jin-Wook ; et al. | 2011-07-07 |
Method Of Packaging A Semiconductor Die
App 20090023248 - Abdo; David F. ; et al. | 2009-01-22 |
Method of packaging a semiconductor die and package thereof
Grant 7,445,967 - Abdo , et al. November 4, 2 | 2008-11-04 |
Semiconductor structure and method of assembly
Grant 7,446,411 - Condie , et al. November 4, 2 | 2008-11-04 |
Semiconductor structure and method of manufacture
Grant 7,429,790 - Condie , et al. September 30, 2 | 2008-09-30 |
Method of packaging a semiconductor die and package thereof
App 20070172990 - Abdo; David F. ; et al. | 2007-07-26 |
Semiconductor structure and method of assembly
App 20070090515 - Condie; Brian W. ; et al. | 2007-04-26 |
Semiconductor structure and method of manufacture
App 20070090514 - Condie; Brian W. ; et al. | 2007-04-26 |
Method of manufacturing a wire bond-less electronic component for use with an external circuit
Grant 6,844,221 - Viswanathan , et al. January 18, 2 | 2005-01-18 |
Method of manufacturing a wire bond-less electronic component for use with an external circuit
App 20040198012 - Viswanathan, Lakshminarayan ; et al. | 2004-10-07 |
Wire bond-less electronic component for use with an external circuit and method of manufacture
Grant 6,724,079 - Viswanathan , et al. April 20, 2 | 2004-04-20 |
Wire bond-less electronic component for use with an external circuit and method of manufacture
App 20030128080 - Viswanathan, Lakshminarayan ; et al. | 2003-07-10 |
Semiconductor component
Grant 6,072,238 - Viswanathan , et al. June 6, 2 | 2000-06-06 |
Semiconductor package
Grant 6,072,211 - Miller , et al. June 6, 2 | 2000-06-06 |
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