| Patent | Date |
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Microelectronic Component Having Molded Regions With Through-mold Vias
App 20220181262 - Ganesan; Sanka ; et al. | 2022-06-09 |
Pitch Translation Architecture For Semiconductor Package Including Embedded Interconnect Bridge
App 20220148968 - COLLINS; Andrew ; et al. | 2022-05-12 |
Microelectronic component having molded regions with through-mold vias
Grant 11,302,643 - Ganesan , et al. April 12, 2 | 2022-04-12 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge
Grant 11,270,942 - Collins , et al. March 8, 2 | 2022-03-08 |
Ic Die With Solderable Thermal Interface Structures For Assemblies Including Solder Array Thermal Interconnects
App 20210305119 - Mallik; Debendra ; et al. | 2021-09-30 |
Microelectronic Component Having Molded Regions With Through-mold Vias
App 20210305162 - Ganesan; Sanka ; et al. | 2021-09-30 |
Ic Die And Heat Spreaders With Solderable Thermal Interface Structures For Assemblies Including Solder Array Thermal Interconnects
App 20210305121 - Mallik; Debendra ; et al. | 2021-09-30 |
Ic Die And Heat Spreaders With Solderable Thermal Interface Structures For Multi-chip Assemblies Including Solder Array Thermal Interconnects
App 20210305120 - Mallik; Debendra ; et al. | 2021-09-30 |
Coupled Cooling Fins In Ultra-small Systems
App 20200273772 - Uppal; Aastha ; et al. | 2020-08-27 |
Pitch Translation Architecture For Semiconductor Package Including Embedded Interconnect Bridge
App 20200235051 - COLLINS; Andrew ; et al. | 2020-07-23 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200227332 - Singh; Kumar Abhishek ; et al. | 2020-07-16 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge
Grant 10,643,945 - Collins , et al. | 2020-05-05 |
Pitch Translation Architecture For Semiconductor Package Including Embedded Interconnect Bridge
App 20190206792 - Collins; Andrew ; et al. | 2019-07-04 |
Integrated Embedded Substrate And Socket
App 20190103349 - VISWANATH; Ram ; et al. | 2019-04-04 |
Chip package connector assembly
Grant 9,674,954 - Swaminathan , et al. June 6, 2 | 2017-06-06 |
Electronic package with narrow-factor via including finish layer
Grant 9,603,247 - Swaminathan , et al. March 21, 2 | 2017-03-21 |
Electronic Package With Narrow-factor Via Including Finish Layer
App 20160044786 - Swaminathan; Rajasekaran ; et al. | 2016-02-11 |
Chip Package Connector Assembly
App 20140268577 - Swaminathan; Rajasekaran Raja ; et al. | 2014-09-18 |
Laminated socket contacts
Grant 6,979,208 - Xie , et al. December 27, 2 | 2005-12-27 |
Laminated socket contacts
App 20050085106 - Xie, Hong ; et al. | 2005-04-21 |
Laminated socket contacts
Grant 6,854,979 - Xie , et al. February 15, 2 | 2005-02-15 |
Laminated socket contacts
Grant 6,672,880 - Xie , et al. January 6, 2 | 2004-01-06 |
Laminated socket contacts
App 20030162419 - Xie, Hong ; et al. | 2003-08-28 |
Laminated socket contacts
App 20030162420 - Xie, Hong ; et al. | 2003-08-28 |
Laminated socket contacts
Grant 6,575,766 - Xie , et al. June 10, 2 | 2003-06-10 |
Heat sink with a heat pipe for spreading of heat
Grant 6,189,601 - Goodman , et al. February 20, 2 | 2001-02-20 |
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