Viswanadam; Gautham
Patent Applications and Registrations
Patent applications and USPTO patent grants for Viswanadam; Gautham.The latest application filed is for "wafer level integration module having controlled resistivity interconnects".
- Viswanadam; Gautham - Singapore SG
| Patent | Date |
|---|---|
| Wafer level integration module having controlled resistivity interconnects Grant 8,329,573 - Viswanadam December 11, 2 | 2012-12-11 |
| Wafer Level Integration Module Having Controlled Resistivity Interconnects App 20110318852 - Viswanadam; Gautham | 2011-12-29 |
| Wafer Level Integration Module With Interconnects App 20110278569 - Viswanadam; Gautham | 2011-11-17 |
| Wafer level integration module with interconnects Grant 7,998,854 - Viswanadam August 16, 2 | 2011-08-16 |
| Wafer Level Integration Module With Interconnects App 20110065215 - Viswanadam; Gautham | 2011-03-17 |
| Integrated circuit device and method of manufacturing thereof Grant 7,785,928 - Viswanadam August 31, 2 | 2010-08-31 |
| Integrated Circuit Device and Method of Manufacturing Thereof App 20100144093 - Viswanadam; Gautham | 2010-06-10 |
| Residue-free solder bumping process Grant 6,759,319 - Viswanadam , et al. July 6, 2 | 2004-07-06 |
| Residue-free solder bumping process App 20020173134 - Viswanadam, Gautham ; et al. | 2002-11-21 |
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