Vindasius; Alfons

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vindasius; Alfons.The latest application filed is for "assembly having stacked die mounted on substrate".

Company Profile

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Vindasius; Alfons - Saratoga CA US
Vindasius; Alfons - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Assembly having stacked die mounted on substrate Grant 8,357,999 - Robinson , et al. January 22, 2	2013-01-22
Die assembly having electrical interconnect Grant 7,535,109 - Robinson , et al. May 19, 2	2009-05-19
Conductive epoxy flip-chip on chip Grant 6,271,598 - Vindasius , et al. August 7, 2	2001-08-07
Vertical interconnect process for silicon segments with dielectric isolation Grant 6,255,726 - Vindasius , et al. July 3, 2	2001-07-03
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform Grant 6,177,296 - Vindasius , et al. January 23, 2	2001-01-23
Vertical interconnect process for silicon segments with thermally conductive epoxy preform Grant 6,124,633 - Vindasius , et al. September 26, 2	2000-09-26
Method for forming conductive epoxy flip-chip on chip Grant 6,098,278 - Vindasius , et al. August 8, 2	2000-08-08
Method for forming vertical interconnect process for silicon segments with dielectric isolation Grant 6,080,596 - Vindasius , et al. June 27, 2	2000-06-27
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform Grant 5,891,761 - Vindasius , et al. April 6, 1	1999-04-06
Method of fabrication of silicon pressure transducer sensor units Grant 3,909,924 - Vindasius , et al. October 7, 1	1975-10-07

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