| Patent | Date |
|---|
Topside heatsinking antenna launcher for an integrated circuit package
Grant 11,456,227 - Vincent , et al. September 27, 2 | 2022-09-27 |
Semiconductor device packaging warpage control
Grant 11,404,288 - Vincent , et al. August 2, 2 | 2022-08-02 |
Package
App 20220231408 - Carluccio; Giorgio ; et al. | 2022-07-21 |
Semiconductor Device Having Integrated Antenna And Method Therefor
App 20220189890 - Vincent; Michael B. ; et al. | 2022-06-16 |
Semiconductor Device Package Having Thermal Dissipation Feature And Method Therefor
App 20220181230 - Vincent; Michael B. ; et al. | 2022-06-09 |
Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide
Grant 11,335,652 - Vincent , et al. May 17, 2 | 2022-05-17 |
Bottom-side heatsinking waveguide for an integrated circuit package
Grant 11,276,654 - Vincent , et al. March 15, 2 | 2022-03-15 |
Semiconductor Device Having A Translation Feature And Method Therefor
App 20220068828 - Vincent; Michael B. ; et al. | 2022-03-03 |
Semiconductor Device Package Having Stress Isolation And Method Therefor
App 20220068738 - Vincent; Michael B. ; et al. | 2022-03-03 |
Semiconductor Device With Waveguide And Method Therefor
App 20210391285 - Vincent; Michael B. ; et al. | 2021-12-16 |
Semiconductor device with waveguide and method therefor
Grant 11,133,273 - Vincent , et al. September 28, 2 | 2021-09-28 |
Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide
Grant 11,133,578 - Kamphuis , et al. September 28, 2 | 2021-09-28 |
Grounding lids in integrated circuit devices
Grant 11,127,645 - Daniels , et al. September 21, 2 | 2021-09-21 |
Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process
Grant 11,121,467 - Tang , et al. September 14, 2 | 2021-09-14 |
No-gel Pressure Sensor Package
App 20210221671 - Hooper; Stephen Ryan ; et al. | 2021-07-22 |
TopSide Heatsinking Antenna Launcher for an Integrated Circuit Package
App 20210183725 - Vincent; Michael B. ; et al. | 2021-06-17 |
Bottom-Side Heatsinking Waveguide for an Integrated Circuit Package
App 20210183797 - Vincent; Michael B. ; et al. | 2021-06-17 |
Semiconductor Device With Waveguide And Method Therefor
App 20210183796 - VINCENT; MICHAEL B. ; et al. | 2021-06-17 |
Package integrated waveguide
Grant 11,031,681 - Vincent , et al. June 8, 2 | 2021-06-08 |
Method and Apparatus for Coupling a Waveguide Structure to an Integrated Circuit Package
App 20210075081 - Kamphuis; Antonius Hendrikus Jozef ; et al. | 2021-03-11 |
Method, System, and Apparatus for Forming Three-Dimensional Semiconductor Device Package with Waveguide
App 20210035927 - Vincent; Michael B. ; et al. | 2021-02-04 |
Semiconductor Device And Method
App 20210028131 - Zanati; Abdellatif ; et al. | 2021-01-28 |
Semiconductor Package with Compact Antenna Formed Using Three-Dimensional Additive Manufacturing Process
App 20200403314 - Tang; Jinbang ; et al. | 2020-12-24 |
Package Integrated Waveguide
App 20200403298 - Vincent; Michael B. ; et al. | 2020-12-24 |
Grounding Lids In Integrated Circuit Devices
App 20200402878 - DANIELS; Dwight Lee ; et al. | 2020-12-24 |
Composite Media Protection For Pressure Sensor
App 20200357715 - Vincent; Michael B. | 2020-11-12 |
Plated opening with vent path
Grant 10,834,817 - Vincent , et al. November 10, 2 | 2020-11-10 |
Shielded semiconductor device and lead frame therefor
Grant 10,654,709 - Ngion , et al. | 2020-05-19 |
High aspect ratio connection for EMI shielding
Grant 10,658,303 - Vincent , et al. | 2020-05-19 |
High Aspect Ratio Connection For Emi Shielding
App 20200152579 - VINCENT; Michael B. ; et al. | 2020-05-14 |
Shielded Semiconductor Device And Lead Frame Therefor
App 20200131030 - Ngion; Lee Fee ; et al. | 2020-04-30 |
Shielded package with integrated antenna
Grant 10,529,670 - Vincent , et al. J | 2020-01-07 |
Fan-out wafer level packages having preformed embedded ground plane connections
Grant 10,440,819 - Vincent O | 2019-10-08 |
Microelectronic devices with multi-layer package surface conductors and methods of their fabrication
Grant 10,388,607 - Gong , et al. A | 2019-08-20 |
Through package circuit in fan-out wafer level package
Grant 10,354,958 - Vincent July 16, 2 | 2019-07-16 |
Shielded Package With Integrated Antenna
App 20190157216 - VINCENT; Michael B. ; et al. | 2019-05-23 |
Shielded package with integrated antenna
Grant 10,236,260 - Vincent , et al. | 2019-03-19 |
Plated Opening With Vent Path
App 20190059157 - Vincent; Michael B. ; et al. | 2019-02-21 |
Packaged devices with multiple planes of embedded electronic devices
Grant 10,163,874 - Vincent , et al. Dec | 2018-12-25 |
Plated opening with vent path
Grant 10,143,084 - Vincent , et al. Nov | 2018-11-27 |
EMI/RFI shielding for semiconductor device packages
Grant 10,074,614 - Gong , et al. September 11, 2 | 2018-09-11 |
Plated Opening With Vent Path
App 20180177049 - Vincent; Michael B. ; et al. | 2018-06-21 |
Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
Grant 9,960,149 - Vincent , et al. May 1, 2 | 2018-05-01 |
Fan-out Wafer Level Packages Having Preformed Embedded Ground Plane Connections
App 20180063948 - VINCENT; MICHAEL B. | 2018-03-01 |
Microelectronic packages having mold-embedded traces and methods for the production thereof
Grant 9,899,298 - Vincent , et al. February 20, 2 | 2018-02-20 |
Shielded Package With Integrated Antenna
App 20180005957 - VINCENT; Michael B. ; et al. | 2018-01-04 |
Packaged Devices With Multiple Planes Of Embedded Electronic Devices
App 20180006001 - VINCENT; MICHAEL B. ; et al. | 2018-01-04 |
Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof
Grant 9,826,630 - Vincent November 21, 2 | 2017-11-21 |
Packaged devices with multiple planes of embedded electronic devices
Grant 9,799,636 - Vincent , et al. October 24, 2 | 2017-10-24 |
Emi/rfi Shielding For Semiconductor Device Packages
App 20170263572 - Gong; Zhiwei ; et al. | 2017-09-14 |
Electronic component package with multple electronic components
Grant 9,761,570 - Vincent , et al. September 12, 2 | 2017-09-12 |
Microelectronic packages having embedded sidewall substrates and methods for the producing thereof
Grant 9,761,565 - Vincent , et al. September 12, 2 | 2017-09-12 |
Integrated electronic package and stacked assembly thereof
Grant 9,698,104 - Yap , et al. July 4, 2 | 2017-07-04 |
EMI/RFI shielding for semiconductor device packages
Grant 9,673,150 - Gong , et al. June 6, 2 | 2017-06-06 |
Packaged Devices With Multiple Planes Of Embedded Electronic Devices
App 20170141087 - VINCENT; MICHAEL B. ; et al. | 2017-05-18 |
Microelectronic Packages Having Embedded Sidewall Substrates And Methods For The Producing Thereof
App 20170141084 - VINCENT; MICHAEL B. ; et al. | 2017-05-18 |
Microelectronic Packages Having Mold-embedded Traces And Methods For The Production Thereof
App 20170092567 - VINCENT; MICHAEL B. ; et al. | 2017-03-30 |
Microelectronic packages having embedded sidewall substrates and methods for the producing thereof
Grant 9,595,485 - Vincent , et al. March 14, 2 | 2017-03-14 |
Three-dimensional Integrated Circuit Systems In A Package And Methods Therefor
App 20170053862 - GONG; ZHIWEI ; et al. | 2017-02-23 |
Three-dimensional integrated circuit systems in a package and methods therefor
Grant 9,570,387 - Gong , et al. February 14, 2 | 2017-02-14 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,524,950 - Yap , et al. December 20, 2 | 2016-12-20 |
Microelectronic packages having trench vias and methods for the manufacture thereof
Grant 9,520,323 - Vincent , et al. December 13, 2 | 2016-12-13 |
Package-on-package Device And Cavity Formation By Solder Removal For Package Interconnection
App 20160351522 - VINCENT; MICHAEL B. ; et al. | 2016-12-01 |
Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers
Grant 9,502,363 - Vincent , et al. November 22, 2 | 2016-11-22 |
Integrated Electronic Package And Stacked Assembly Thereof
App 20160293551 - Yap; Weng F. ; et al. | 2016-10-06 |
Wafer level packaging method
Grant 9,396,999 - Yap , et al. July 19, 2 | 2016-07-19 |
Microelectronic Devices With Multi-layer Package Surface Conductors And Methods Of Their Fabrication
App 20160181202 - GONG; ZHIWEI ; et al. | 2016-06-23 |
Emi/rfi Shielding For Semiconductor Device Packages
App 20160172309 - Gong; Zhiwei ; et al. | 2016-06-16 |
Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof
Grant 9,355,985 - Vincent , et al. May 31, 2 | 2016-05-31 |
Devices And Stacked Microelectronic Packages With Package Surface Conductors And Methods Of Their Fabrication
App 20160133608 - Vincent; Michael B. ; et al. | 2016-05-12 |
Microelectronic packages having mold-embedded traces and methods for the production thereof
Grant 9,331,029 - Vincent , et al. May 3, 2 | 2016-05-03 |
Through Package Circuit in Fan-Out Wafer Level Package
App 20160099212 - Vincent; Michael B. | 2016-04-07 |
Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication
Grant 9,305,911 - Vincent , et al. April 5, 2 | 2016-04-05 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,299,670 - Yap , et al. March 29, 2 | 2016-03-29 |
Fan-out Wafer Level Packages Having Preformed Embedded Ground Plane Connections And Methods For The Fabrication Thereof
App 20160073496 - VINCENT; MICHAEL B. | 2016-03-10 |
Microelectronic packages having layered interconnect structures and methods for the manufacture thereof
Grant 9,281,293 - Magnus , et al. March 8, 2 | 2016-03-08 |
Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
Grant 9,263,420 - Vincent , et al. February 16, 2 | 2016-02-16 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,257,415 - Vincent , et al. February 9, 2 | 2016-02-09 |
Embedded electrical component surface interconnect
Grant 9,245,819 - Vincent January 26, 2 | 2016-01-26 |
Three Dimensional Package Assemblies And Methods For The Production Thereof
App 20160013076 - VINCENT; MICHAEL B. ; et al. | 2016-01-14 |
Wafer Level Packaging Method And Integrated Electronic Package
App 20160005628 - Yap; Weng F. ; et al. | 2016-01-07 |
Microelectronic Packages Having Embedded Sidewall Substrates And Methods For The Producing Thereof
App 20150380386 - VINCENT; MICHAEL B. ; et al. | 2015-12-31 |
Microelectronic Packages Having Sidewall-deposited Heat Spreader Structures And Methods For The Fabrication Thereof
App 20150348865 - VINCENT; MICHAEL B. ; et al. | 2015-12-03 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,190,390 - Gong , et al. November 17, 2 | 2015-11-17 |
Wafer Level Packages And Methods For Producing Wafer Level Packages Having Delamination-resistant Redistribution Layers
App 20150270233 - VINCENT; MICHAEL B. ; et al. | 2015-09-24 |
Microelectronic Packages Having Mold-embedded Traces And Methods For The Production Thereof
App 20150262931 - VINCENT; MICHAEL B. ; et al. | 2015-09-17 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20150243635 - VINCENT; MICHAEL B. ; et al. | 2015-08-27 |
Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof
Grant 9,111,870 - Vincent August 18, 2 | 2015-08-18 |
Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof
Grant 9,093,457 - Gong , et al. July 28, 2 | 2015-07-28 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,064,977 - June 23, 2 | 2015-06-23 |
Devices And Stacked Microelectronic Packages With Package Surface Conductors And Methods Of Their Fabrication
App 20150162309 - VINCENT; MICHAEL B. ; et al. | 2015-06-11 |
Devices And Stacked Microelectronic Packages With Package Surface Conductors And Adjacent Trenches And Methods Of Their Fabrication
App 20150162310 - VINCENT; MICHAEL B. ; et al. | 2015-06-11 |
Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication
Grant 9,036,363 - Vincent , et al. May 19, 2 | 2015-05-19 |
Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication
Grant 9,025,340 - Wright , et al. May 5, 2 | 2015-05-05 |
Microelectronic Packages Having Layered Interconnect Structures And Methods For The Manufacture Thereof
App 20150115454 - Magnus; Alan J. ; et al. | 2015-04-30 |
Microelectronic Packages Containing Stacked Microelectronic Devices And Methods For The Fabrication Thereof
App 20150108661 - VINCENT; MICHAEL B. | 2015-04-23 |
Devices And Stacked Microelectronic Packages With In-trench Package Surface Conductors And Methods Of Their Fabrication
App 20150092377 - WRIGHT; JASON R. ; et al. | 2015-04-02 |
Devices And Stacked Microelectronic Packages With Parallel Conductors And Intra-conductor Isolator Structures And Methods Of Their Fabrication
App 20150092372 - VINCENT; MICHAEL B. ; et al. | 2015-04-02 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20140353840 - YAP; WENG F. ; et al. | 2014-12-04 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20140264945 - YAP; WENG F. ; et al. | 2014-09-18 |
Microelectronic Packages Having Trench Vias And Methods For The Manufacture Thereof
App 20140070415 - Vincent; Michael B. ; et al. | 2014-03-13 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20140054783 - GONG (Tony); ZHIWEI ; et al. | 2014-02-27 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20140054797 - Gong (Tony); Zhiwei ; et al. | 2014-02-27 |
Stacked Microelectronic Packages Having Patterened Sidewall Conductors And Methods For The Fabrication Thereof
App 20140054796 - Gong; Zhiwei (Tony) ; et al. | 2014-02-27 |
Embedded Electrical Component Surface Interconnect
App 20130215583 - Vincent; Michael B. | 2013-08-22 |
Electronic device comprising electrically stable copper filled electrically conductive adhesive
Grant 8,293,141 - Gaynes , et al. October 23, 2 | 2012-10-23 |
Electrically stable copper filled electrically conductive adhesive
Grant 7,763,188 - Gaynes , et al. July 27, 2 | 2010-07-27 |
Electrically Stable Copper Filled Electrically Conductive Adhesive
App 20080230262 - Gaynes; Michael ; et al. | 2008-09-25 |
Process For Preparing An Electrically Stable Copper Filled Electrically Conductive Adhesive
App 20080223604 - Gaynes; Michael ; et al. | 2008-09-18 |
SMT passive device noflow underfill methodology and structure
Grant 7,408,264 - Fortin , et al. August 5, 2 | 2008-08-05 |
SMT passive device noflow underfill methodology and structure
App 20060290008 - Fortin; Clement J. ; et al. | 2006-12-28 |
SMT passive device noflow underfill methodology and structure
Grant 7,109,592 - Fortin , et al. September 19, 2 | 2006-09-19 |
Electrically stable copper filled electrically conductive adhesive
App 20060197065 - Gaynes; Michael ; et al. | 2006-09-07 |
Packaging integrated circuits with adhesive posts
Grant 7,094,966 - Bonitz , et al. August 22, 2 | 2006-08-22 |
Flip-chip package with underfill having low density filler
Grant 6,815,258 - Vincent November 9, 2 | 2004-11-09 |
SMT passive device noflow underfill methodology and structure
App 20040180469 - Fortin, Clement J. ; et al. | 2004-09-16 |
SMT passive device noflow underfill methodology and structure
Grant 6,739,497 - Fortin , et al. May 25, 2 | 2004-05-25 |
Packaging integrated circuits with adhesive posts
App 20040075990 - Bonitz, Barry A. ; et al. | 2004-04-22 |
Flip-chip package with underfill having low density filler
App 20040026792 - Vincent, Michael B. | 2004-02-12 |
Flip-chip package with underfill having low density filler
Grant 6,674,172 - Vincent January 6, 2 | 2004-01-06 |
SMT passive device noflow underfill methodology and structure
App 20030209590 - Fortin, Clement J. ; et al. | 2003-11-13 |
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