VIKING TECH CORPORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for VIKING TECH CORPORATION.The latest application filed is for "method for manufacturing thin film resistive layer".
- VIKING TECH CORPORATION - Hukou Township Hsinchu County TW
- VIKING TECH CORPORATION - Hsinchu County N/A TW
- VIKING TECH CORPORATION - Hsinchu County 303 TW
- VIKING TECH CORPORATION - Hsinchu Country TW
- Viking Tech Corporation -
- Viking Tech Corporation - Hsinchu TW
Trademarks
| Patent | Date |
|---|---|
| Resistor element Grant 11,205,531 - Kuo , et al. December 21, 2 | 2021-12-21 |
| Method For Manufacturing Thin Film Resistive Layer App 20210305031 - CHIU; CHENG-CHUNG ; et al. | 2021-09-30 |
| Resistor Element App 20210304924 - KUO; MING-CHIEH ; et al. | 2021-09-30 |
| Thin film resistor element Grant 10,892,071 - Chiu , et al. January 12, 2 | 2021-01-12 |
| Resistor element Grant 10,755,839 - Kuo A | 2020-08-25 |
| Resistor Element App 20200185132 - KUO; SHUN-HO | 2020-06-11 |
| Four-terminal resistor Grant 10,622,123 - Lu , et al. | 2020-04-14 |
| Ceramic substrate and semiconductor package having the same Grant 9,837,592 - Ho , et al. December 5, 2 | 2017-12-05 |
| Carrier package and carrier with plural heat conductors Grant 9,768,092 - Ho , et al. September 19, 2 | 2017-09-19 |
| Micro-resistance structure with high bending strength, manufacturing method and semi-finished structure thereof Grant 9,728,306 - Lu , et al. August 8, 2 | 2017-08-08 |
| Method for manufacturing ceramic substrate Grant 9,437,549 - Ho , et al. September 6, 2 | 2016-09-06 |
| Resistor component Grant 9,373,430 - Wei , et al. June 21, 2 | 2016-06-21 |
| Micro-Resistance Structure with High Bending Strength, Manufacturing Method and Semi-Finished Structure Thereof App 20160064122 - LU; Chi-Yu ; et al. | 2016-03-03 |
| Ceramic substrate, package substrate, semiconductor chip package component and manufacturing method thereof App 20160049372 - HO; Chien-Hung ; et al. | 2016-02-18 |
| Method of electroplating and depositing metal Grant 9,204,555 - Wei , et al. December 1, 2 | 2015-12-01 |
| Ceramic Substrate and Semiconductor Package Having the Same App 20150303362 - Ho; Chien-Hung ; et al. | 2015-10-22 |
| Carrier and Package Having the Carrier App 20150305201 - Ho; Chien-Hung ; et al. | 2015-10-22 |
| Method for forming package substrate Grant 8,841,172 - Wei , et al. September 23, 2 | 2014-09-23 |
| Method of Forming Substrate App 20140170848 - Wei; Shih-Long ; et al. | 2014-06-19 |
| Resistor Component App 20140167911 - Wei; Shih-Long ; et al. | 2014-06-19 |
| Method of Fabricating a Light Emitting Diode Packaging Structure App 20140027051 - Wei; Shih-Long ; et al. | 2014-01-30 |
| Method of Electroplating and Depositing Metal App 20140001051 - Wei; Shih-Long ; et al. | 2014-01-02 |
| Method For Fabricating Conductive Structures of Substrate App 20130313122 - Wei; Shih-Long ; et al. | 2013-11-28 |
| Method of manufacturing a metallized ceramic substrate Grant 8,591,756 - Wei , et al. November 26, 2 | 2013-11-26 |
| Method for manufacturing alloy resistor Grant 8,590,140 - Wei , et al. November 26, 2 | 2013-11-26 |
| Method for Selective Metallization on a Ceramic Substrate App 20130098867 - Wei; Shih-Long ; et al. | 2013-04-25 |
| Method of Fabricating a Substrate Having Conductive Through Holes App 20130089982 - WEI; Shih-Long ; et al. | 2013-04-11 |
| Light Emitting Diode Packaging Structure and Method of Fabricating the Same App 20130082292 - Wei; Shih-Long ; et al. | 2013-04-04 |
| Method of Manufacturing a Metallized Ceramic Substrate App 20130048602 - Wei; Shih-Long ; et al. | 2013-02-28 |
| Method for Forming Package Substrate App 20120317806 - Wei; Shih-Long ; et al. | 2012-12-20 |
| Package Substrate and Method for Forming the Same App 20120211792 - Wei; Shih-Long ; et al. | 2012-08-23 |
| Method for Manufacturing Alloy Resistor App 20120000066 - Wei; Shih-Long ; et al. | 2012-01-05 |
| Light-Emitting Diode Packaging Structure and Substrate Therefor App 20120001212 - Wei; Shih-Long ; et al. | 2012-01-05 |
| Method of making a current sensing chip resistor Grant 7,640,652 - Hsiao , et al. January 5, 2 | 2010-01-05 |
| Method of making a current sensing chip resistor App 20080194057 - Hsiao; Shen-Li ; et al. | 2008-08-14 |
| Packaging method of thin film passive components on silicon chip Grant 6,083,766 - Chen July 4, 2 | 2000-07-04 |
| NCAGE Code | SXJ88 | VIKING TECH CORPORATION |
| CAGE Code | SXJ88 | VIKING TECH CORPORATION |
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