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Photoimageable, aqueous acid soluble polyimide polymers
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Photoimageable, aqueous acid soluble polyimide polymers
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Photoimageable, aqueous acid soluble polyimide polymers
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High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer
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Method for providing a selective reference layer isolation technique for the production of printed circuit boards
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Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
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Composition containing a polymer and conductive filler and use thereof
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Fluorinated carbon polymer composites
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System for applying microware energy in processing sheet like materials
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Toughened polycyanurate resins containing particulates
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Photovoltaic array for computer display
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Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation
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Method for bonding two surfaces together
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Method for conditioning a substrate for subsequent electroless metal deposition
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Fluorinated carbon polymer composites
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Method for conditioning halogenated polymeric materials and structures fabricated therewith
Grant 5,374,454 - Bickford , et al. December 20, 1 | 1994-12-20 |
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
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Low dielectric constant fluorinated polymers and methods of fabrication thereof
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Conditioning of a substrate for electroless plating thereon
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Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes
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Isoimide modifications of a polyimide and reaction thereof with nucleophiles
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Charge transfer salts and uses thereof
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Method for conditioning an organic polymeric material
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Surface midification of a polyimide
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Derivatives of compounds containing a carbonyl group conjugated to an aromatic moiety and electrophilic methods of fabrication thereof
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Multilayer structures of different electroactive materials and methods of fabrication thereof
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