Vick; Erik Paul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Vick; Erik Paul.The latest application filed is for "laser-formed interconnects for redundant devices".
- Vick; Erik Paul - Raleigh NC
| Patent | Date |
|---|---|
| Laser-formed Interconnects For Redundant Devices App 20220165666 - Radauscher; Erich ; et al. | 2022-05-26 |
| Laser-formed interconnects for redundant devices Grant 11,282,786 - Radauscher , et al. March 22, 2 | 2022-03-22 |
| Pixel Modules With Controllers And Light Emitters App 20210151630 - Bower; Christopher Andrew ; et al. | 2021-05-20 |
| Pixel modules with controllers and light emitters Grant 10,944,027 - Bower , et al. March 9, 2 | 2021-03-09 |
| Modules With Integrated Circuits And Devices App 20210043618 - Bower; Christopher Andrew ; et al. | 2021-02-11 |
| Pixel Modules With Controllers And Light Emitters App 20200395510 - Bower; Christopher Andrew ; et al. | 2020-12-17 |
| Laser-formed Interconnects For Redundant Devices App 20200194370 - Radauscher; Erich ; et al. | 2020-06-18 |
| Redundant Pixel Layouts App 20200051482 - Cok; Ronald S. ; et al. | 2020-02-13 |
| Electronic packages with three-dimensional conductive planes, and methods for fabrication Grant 10,418,344 - Vick , et al. Sept | 2019-09-17 |
| Electronic Packages With Three-dimensional Conductive Planes, And Methods For Fabrication App 20180151542 - Vick; Erik Paul ; et al. | 2018-05-31 |
| Highly-integrated Thermoelectric Cooler App 20170324016 - BARLETTA; Philip ; et al. | 2017-11-09 |
| Three-dimensional electronic packages utilizing unpatterned adhesive layer Grant 9,576,889 - Vick February 21, 2 | 2017-02-21 |
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