VIA Technologies, Inc. of R.O.C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for VIA Technologies, Inc. of R.O.C..The latest application filed is for "non-metal mesh cover for metal chassis".
- VIA Technologies, Inc. of R.O.C. - Taipei TW
- VIA Technologies, Inc. of R.O.C. -
| Patent | Date |
|---|---|
| Non-metal mesh cover for metal chassis Grant 7,355,849 - Ku April 8, 2 | 2008-04-08 |
| Non-metal mesh cover for metal chassis App 20070184245 - Ku; Shih-Chang | 2007-08-09 |
| Prevention of latch-up among p-type semiconductor devices App 20070120196 - Chen; Ke-Yuan ; et al. | 2007-05-31 |
| Latch-up prevention in semiconductor circuits App 20070122963 - Chen; Ke-Yuan ; et al. | 2007-05-31 |
| Multi-terminal capacitor App 20070102788 - Yang; Shun Cheng | 2007-05-10 |
| CDMA wireless communication system including finite impulse response filter and phase equalizer for inter-chip interference reduction Grant 6,980,771 - Yang December 27, 2 | 2005-12-27 |
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