loadpatents
name:-0.0084710121154785
name:-0.0086259841918945
name:-0.0031330585479736
Vetter; James C. Patent Filings

Vetter; James C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vetter; James C..The latest application filed is for "edge ring assembly for improving feature profile tilting at extreme edge of wafer".

Company Profile
1.6.7
  • Vetter; James C. - Pine Grove CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Edge ring assembly for improving feature profile tilting at extreme edge of wafer
Grant 10,854,492 - Bosch , et al. December 1, 2
2020-12-01
Measuring and controlling wafer potential in pulsed RF bias processing
Grant 9,659,757 - Kuthi , et al. May 23, 2
2017-05-23
Edge Ring Assembly For Improving Feature Profile Tilting At Extreme Edge Of Wafer
App 20170053820 - Bosch; William Frederick ;   et al.
2017-02-23
Measuring And Controlling Wafer Potential In Pulsed Rf Bias Processing
App 20130050892 - Kuthi; Andras ;   et al.
2013-02-28
Measuring and controlling wafer potential in pulsed RF bias processing
Grant 8,303,763 - Kuthi , et al. November 6, 2
2012-11-06
Measuring And Controlling Wafer Potential In Pulsed Rf Bias Processing
App 20120206127 - Kuthi; Andras ;   et al.
2012-08-16
Methods of and apparatus for measuring and controlling wafer potential in pulsed RF bias processing
Grant 8,192,576 - Kuthi , et al. June 5, 2
2012-06-05
Methods of and apparatus for measuring and controlling wafer potential in pulsed RF bias processing
App 20100315064 - Kuthi; Andras ;   et al.
2010-12-16
Electronically diagnosing a component in a process line using a substrate signature
Grant 6,946,303 - Flanner , et al. September 20, 2
2005-09-20
System and method for creating a substrate signature
Grant 6,890,774 - Flanner , et al. May 10, 2
2005-05-10
System and method for creating a substrate signature
App 20040110312 - Flanner, Janet M. ;   et al.
2004-06-10
Electronically diagnosing a component in a process line using a substrate signature
App 20040110311 - Flanner, Janet M. ;   et al.
2004-06-10

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