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Patent applications and USPTO patent grants for Verdonck; Patrick.The latest application filed is for "method of bonding semiconductor substrates".
Patent | Date |
---|---|
Method of bonding semiconductor substrates Grant 10,141,284 - Kim , et al. Nov | 2018-11-27 |
Method Of Bonding Semiconductor Substrates App 20170301646 - Kim; Soon-Wook ;   et al. | 2017-10-19 |
Fabrication of porogen residues free low-k materials with improved mechanical and chemical resistance Grant 8,974,870 - Baklanov , et al. March 10, 2 | 2015-03-10 |
Method For Developing Low Dielectric Constant Film And Devices Obtained Thereof App 20140099796 - Verdonck; Patrick ;   et al. | 2014-04-10 |
Fabrication Of Porogen Residues Free Low-k Materials With Improved Mechanical And Chemical Resistance App 20120052692 - Baklanov; Mikhail ;   et al. | 2012-03-01 |
Fabrication Of Porogen Residues Free And Mechanically Robust Low-k Materials App 20110006406 - Urbanowicz; Adam Michal ;   et al. | 2011-01-13 |
Method For Etching 3d Structures In A Semiconductor Substrate, Including Surface Preparation App 20100216308 - Verdonck; Patrick ;   et al. | 2010-08-26 |
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