Venugopalan; Hari S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Venugopalan; Hari S..The latest application filed is for "laser lift-off with improved light extraction".

Company Profile

0.11.17

Venugopalan; Hari S. - Somerset NJ
Venugopalan; Hari S. - Bridgewater NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Underfill for light emitting device Grant 7,843,074 - Gao , et al. November 30, 2	2010-11-30
Laser Lift-off With Improved Light Extraction App 20100181584 - Gao; Xiang ; et al.	2010-07-22
Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact Grant 7,385,229 - Venugopalan June 10, 2	2008-06-10
Small footprint high power light emitting package with plurality of light emitting diode chips App 20080121902 - Sackrison; Michael ; et al.	2008-05-29
Flip-chip light emitting diode with indium-tin-oxide based reflecting contacts Grant 7,358,539 - Venugopalan , et al. April 15, 2	2008-04-15
Underfill for light emitting device App 20080061312 - Gao; Xiang ; et al.	2008-03-13
LED with series-connected monolithically integrated mesas Grant 7,285,801 - Eliashevich , et al. October 23, 2	2007-10-23
Flip-chip light emitting diode device without sub-mount App 20070114557 - Shelton; Bryan S. ; et al.	2007-05-24
Lateral current GaN flip chip LED with shaped transparent substrate App 20070096120 - Eliashevich; Ivan ; et al.	2007-05-03
GaN LED with solderable backside metal Grant 7,190,005 - Gibb , et al. March 13, 2	2007-03-13
Flip-chip light emitting diode device without sub-mount Grant 7,179,670 - Shelton , et al. February 20, 2	2007-02-20
Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact Grant 7,141,828 - Venugopalan November 28, 2	2006-11-28
Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact App 20060261363 - Venugopalan; Hari S.	2006-11-23
Increased light extraction from a nitride LED Grant 7,125,734 - Sackrison , et al. October 24, 2	2006-10-24
Increased Light Extraction From A Nitride Led App 20060202223 - Sackrison; Michael J. ; et al.	2006-09-14
High reflectivity p-contacts for group lll-nitride light emitting diodes App 20060186552 - Venugopalan; Hari S.	2006-08-24
Flip chip light emitting diode with micromesas and a conductive mesh Grant 7,064,356 - Stefanov , et al. June 20, 2	2006-06-20
Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes Grant 7,022,550 - Venugopalan April 4, 2	2006-04-04
Thick laser-scribed GaN-on-sapphire optoelectronic devices App 20050263854 - Shelton, Bryan S. ; et al.	2005-12-01
Flip Chip Light Emitting Diode With Micromesas And A Conductive Mesh App 20050230700 - Stefanov, Emil P. ; et al.	2005-10-20
LED with series-connected monolithically integrated mesas App 20050225973 - Eliashevich, Ivan ; et al.	2005-10-13
High reflectivity p-contacts for group III-nitride light emitting diodes App 20050224990 - Venugopalan, Hari S.	2005-10-13
Flip-chip light emitting diode device without sub-mount App 20050194605 - Shelton, Bryan S. ; et al.	2005-09-08
GaN LED with solderable backside metal App 20040232439 - Gibb, Shawn R. ; et al.	2004-11-25
Flip-chip Light Emitting Diode With Indium-tin-oxide Based Reflecting Contacts App 20040201110 - Venugopalan, Hari S. ; et al.	2004-10-14
Flip-chip Light Emitting Diode With A Thermally Stable Multiple Layer Reflective P-type Contact App 20040182914 - Venugopalan, Hari S.	2004-09-23
GaN LED with solderable backside metal Grant 6,787,435 - Gibb , et al. September 7, 2	2004-09-07
GaN LED with solderable backside metal App 20030010975 - Gibb, Shawn R. ; et al.	2003-01-16

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