Venugopalan; Hari
Patent Applications and Registrations
Patent applications and USPTO patent grants for Venugopalan; Hari.The latest application filed is for "optimized contact design for thermosonic bonding of flip-chip devices".
- Venugopalan; Hari - Somerset NJ
| Patent | Date |
|---|---|
| Optimized contact design for thermosonic bonding of flip-chip devices Grant 7,667,236 - Eliashevich , et al. February 23, 2 | 2010-02-23 |
| Optimized contact design for thermosonic bonding of flip-chip devices App 20070145379 - Eliashevich; Ivan ; et al. | 2007-06-28 |
| Microelectronic package having improved light extraction Grant 7,023,022 - Eliashevich , et al. April 4, 2 | 2006-04-04 |
| Led packages having improved light extraction Grant 7,015,516 - Eliashevich , et al. March 21, 2 | 2006-03-21 |
| Optimized contact design for flip-chip LED Grant 6,958,498 - Shelton , et al. October 25, 2 | 2005-10-25 |
| GaN based LED lighting extraction efficiency using digital diffractive phase grating Grant 6,903,379 - Wang , et al. June 7, 2 | 2005-06-07 |
| Optoelectronic device with improved light extraction Grant 6,746,889 - Eliashevich , et al. June 8, 2 | 2004-06-08 |
| Led packages having improved light extraction App 20040070004 - Eliashevich, Ivan ; et al. | 2004-04-15 |
| Microelectronic package having improved light extraction App 20040065886 - Eliashevich, Ivan ; et al. | 2004-04-08 |
| Optimized contact design for flip-chip LED App 20040061123 - Shelton, Bryan ; et al. | 2004-04-01 |
| Contact to n-GaN with Au termination Grant 6,653,215 - Brown , et al. November 25, 2 | 2003-11-25 |
| GaN based LED lighting extraction efficiency using digital diffractive phase grating App 20030213969 - Wang, Michael ; et al. | 2003-11-20 |
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