Ventec International Group Limited
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ventec International Group Limited.The latest application filed is for "epoxy resin varnishes, laminates and printed circuit boards".
- Ventec International Group Limited - Apia WS
| Patent | Date |
|---|---|
| Epoxy Resin Varnishes, Laminates And Printed Circuit Boards App 20100092764 - CHUNG; Chien-Jen ; et al. | 2010-04-15 |
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