Ventec Electronics (Suzhou) Co., Ltd.
USPTO Trademark & Patent Filings
Trademark applications and grants for Ventec Electronics (suzhou) Co., Ltd.. Ventec Electronics (suzhou) Co., Ltd. has 4 trademark applications. The latest application filed is for "TEC-PACK"
- Company Aliases
- Ventec Electronics (Suzhou) Co., Ltd.
- VENTEC ELECTRONICS (SUZHOU) CO., LTD. - Suzhou Jiangsu CN
- Ventec Electronics (Suzhou) company limited - Suzhou CN
| State Incorporated | No Place Where Organized Found |
| Entity Type | UNKNOWN |
| Address | 308 Taishan Road, New District Suzhou City, Jiangsu CHINA 215129 |
Trademarks Patents
| Patent Application | Date |
|---|---|
| Fluorinated Vinyl Polymer Resin Composition, Prepreg and Laminate Materials Containing the same 20180201809 - 15/418644 Chung; Chien-Jen ; et al. | 2018-07-19 |
| COPPER CLAD LAMINATE, PREPREG AND METHOD OF REDUCING SIGNAL LOSS 20100248569 - 12/700725 PENG; Dai Xin ; et al. | 2010-09-30 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"TEC-PACK" 90440015 |
TEC-PACK 2020-12-31 |
"VENTEC-PACK" 90390789 |
VENTEC-PACK 2020-12-17 |
"AEROLAM" 88891830 |
AEROLAM 2020-04-28 |
"AUTOLAM" 88891906 |
AUTOLAM 2020-04-28 |
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