loadpatents
Patent applications and USPTO patent grants for Venkatesappa; Prakash.The latest application filed is for "camera module design with lead frame and plastic moulding".
Patent | Date |
---|---|
Bending a circuit-bearing die Grant 11,128,786 - Toc , et al. September 21, 2 | 2021-09-21 |
Camera module design with lead frame and plastic moulding Grant 10,447,900 - Yang , et al. Oc | 2019-10-15 |
Camera Module Design With Lead Frame And Plastic Moulding App 20170041513 - Yang; Annabelle Q. ;   et al. | 2017-02-09 |
Clamping mechanism for processing of a substrate within a substrate carrier Grant 9,443,819 - Afable , et al. September 13, 2 | 2016-09-13 |
Bending A Circuit-bearing Die App 20160150131 - Toc; Howell John Chua ;   et al. | 2016-05-26 |
Clamping Mechanism For Processing Of A Substrate Within A Substrate Carrier App 20150228529 - Afable; Gerard Anthony C. ;   et al. | 2015-08-13 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.