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name:-0.11292099952698
name:-0.0092990398406982
name:-0.0013351440429688
Venkataraman; Shyam Sundar Patent Filings

Venkataraman; Shyam Sundar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Venkataraman; Shyam Sundar.The latest application filed is for "metal-doped tin oxide for electrocatalysis applications".

Company Profile
1.12.21
  • Venkataraman; Shyam Sundar - Florham Park NJ
  • Venkataraman; Shyam Sundar - Zhongli TW
  • Venkataraman; Shyam Sundar - Ludwigshafen N/A DE
  • Venkataraman; Shyam Sundar - Zhongli City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Metal-doped tin oxide for electrocatalysis applications
Grant 11,110,433 - Peng , et al. September 7, 2
2021-09-07
Metal-doped Tin Oxide For Electrocatalysis Applications
App 20190060874 - PENG; Xu Yuan ;   et al.
2019-02-28
Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
Grant 9,524,874 - Venkataraman , et al. December 20, 2
2016-12-20
Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives
Grant 9,487,675 - Raman , et al. November 8, 2
2016-11-08
Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid
Grant 9,458,415 - Li , et al. October 4, 2
2016-10-04
Aqueous, nitrogen-free cleaning composition and its use for removing residues and contaminants from semiconductor substrates suitable for manufacturing microelectronic devices
Grant 9,275,851 - Klipp , et al. March 1, 2
2016-03-01
Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles
Grant 9,255,214 - Lauter , et al. February 9, 2
2016-02-09
Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of borophosphosilicate glass (BPSG) material in the presence of a CMP composition comprising anionic phosphate or phosphonate
Grant 9,157,012 - Venkataraman , et al. October 13, 2
2015-10-13
Chemical Mechanical Polishing Composition Comprising Polyvinyl Phosphonic Acid And Its Derivatives
App 20150159050 - Raman; Vijay Immanuel ;   et al.
2015-06-11
Post Chemical-mechanical-polishing (post-cmp) Cleaning Composition Comprising A Specific Sulfur-containing Compound And A Sugar Alcohol Or A Polycarboxylic Acid
App 20150018261 - Li; Yuzhuo ;   et al.
2015-01-15
Process For The Manufacture Of Semiconductor Devices Comprising The Chemical Mechanical Polishing Of Borophosphosilicate Glass (bpsg) Material In The Presence Of A Cmp Composition Comprising Anionic Phosphate Or Phosphonate
App 20140326701 - Venkataraman; Shyam Sundar ;   et al.
2014-11-06
Aqueous, Nitrogen-free Cleaning Composition And Its Use For Removing Residues And Contaminants From Semiconductor Substrates Suitable For Manufacturing Microelectronic Devices
App 20140011359 - Klipp; Andreas ;   et al.
2014-01-09
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrates Containing Silicon Oxide Dielectric And Polysilicon Films
App 20130248756 - Venkataraman; Shyam Sundar ;   et al.
2013-09-26
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrates For Electrical, Mechanical And Optical Devices
App 20130200038 - Li; Yuzhuo ;   et al.
2013-08-08
Aqueous Polishing Compositions Containing N-substituted Diazenium Dioxides And/or N'-hydroxy-diazenium Oxide Salts
App 20130200039 - Noller; Bastian ;   et al.
2013-08-08
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrates Containing Silicon Oxide Dielectric And Polysilicon Films
App 20130168348 - Li; Yuzhuo ;   et al.
2013-07-04
Process For Chemically Mechanically Polishing Substrates Containing Silicon Oxide Dielectric Films And Polysilicon And/or Silicon Nitride Films
App 20130171824 - Li; Yuzhuo ;   et al.
2013-07-04
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrate Materials For Electrical, Mechanical And Optical Devices
App 20130161285 - Li; Yuzhuo ;   et al.
2013-06-27
Chemical Mechanical Polishing (cmp) Composition Comprising Inorganic Particles And Polymer Particles
App 20120208344 - Lauter; Michael ;   et al.
2012-08-16

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