Velo; Lino A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Velo; Lino A..The latest application filed is for "microelectronic interconnect material with adhesion promotion layer and fabrication method".

Company Profile

0.9.3

Velo; Lino A. - San Ramon CA
Velo; Lino A. - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating a semiconductor chip interconnect Grant 6,812,126 - Paranjpe , et al. November 2, 2	2004-11-02
Microelectronic interconnect material with adhesion promotion layer and fabrication method Grant 6,645,847 - Paranjpe , et al. November 11, 2	2003-11-11
Microelectronic interconnect material with adhesion promotion layer and fabrication method Grant 6,627,995 - Paranjpe , et al. September 30, 2	2003-09-30
Method for forming a copper film on a substrate Grant 6,461,675 - Paranjpe , et al. October 8, 2	2002-10-08
Microelectronic interconnect material with adhesion promotion layer and fabrication method App 20020137332 - Paranjpe, Ajit P. ; et al.	2002-09-26
Microelectronic interconnect material with adhesion promotion layer and fabrication method App 20020102838 - Paranjpe, Ajit P. ; et al.	2002-08-01
Microelectronic interconnect material with adhesion promotion layer and fabrication method Grant 6,365,502 - Paranjpe , et al. April 2, 2	2002-04-02
Method For Forming A Copper Film On A Substrate App 20020006468 - PARANJPE, AJIT P. ; et al.	2002-01-17
Semiconductor chip interconnect barrier material and fabrication method Grant 6,294,836 - Paranjpe , et al. September 25, 2	2001-09-25
Wireless temperature calibration device and method Grant 5,326,170 - Moslehi , et al. July 5, 1	1994-07-05
Apparatus and method for determining wafer temperature using pyrometry Grant 5,305,417 - Najm , et al. April 19, 1	1994-04-19
Wireless temperature calibration device and method Grant 5,265,957 - Moslehi , et al. November 30, 1	1993-11-30

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