Vayyapron; Shoju
Patent Applications and Registrations
Patent applications and USPTO patent grants for Vayyapron; Shoju.The latest application filed is for "nozzle for uniform plasma processing".
- Vayyapron; Shoju - Bangalore IN
| Patent | Date |
|---|---|
| Nozzle for uniform plasma processing Grant 11,053,590 - Mishra , et al. July 6, 2 | 2021-07-06 |
| Hybrid substrate carrier Grant 10,777,442 - Thirunavukarasu , et al. Sept | 2020-09-15 |
| Nozzle For Uniform Plasma Processing App 20200017972 - Mishra; Rohit ; et al. | 2020-01-16 |
| Nozzle for uniform plasma processing Grant 10,465,288 - Mishra , et al. No | 2019-11-05 |
| Process Kit For Processing Reduced Sized Substrates App 20190259635 - PARATHITHASAN; KARRTHIK ; et al. | 2019-08-22 |
| Deposition Ring For Processing Reduced Size Substrates App 20190259647 - THIRUNAVUKARASU; SRISKANTHARAJAH ; et al. | 2019-08-22 |
| Methods and apparatus for correcting substrate deformity Grant 10,325,790 - Peh , et al. | 2019-06-18 |
| Methods And Apparatus For Correcting Substrate Deformity App 20180218928 - PEH; Eng Sheng ; et al. | 2018-08-02 |
| Hybrid Substrate Carrier App 20180144969 - THIRUNAVUKARASU; SRISKANTHARAJAH ; et al. | 2018-05-24 |
| Nozzle For Uniform Plasma Processing App 20160047040 - MISHRA; ROHIT ; et al. | 2016-02-18 |
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