Vasoya; Kalu K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Vasoya; Kalu K..The latest application filed is for "build-up printed wiring board substrate having a core layer that is part of a circuit".

Company Profile

3.17.14

Vasoya; Kalu K. - Corona CA
Vasoya; Kalu K. - Yorba Linda CA
Vasoya; Kalu K. - Placentia CA US
Vasoya; Kalu K. - Santa Ana CA
Vasoya; Kalu K. - Huntington Beach CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit board having arrangements of light-emitting diodes Grant D893,439 - Vasoya , et al. A	2020-08-18
Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly Grant 10,531,556 - Vasoya J	2020-01-07
Circuit board having arrangements of light-emitting diodes Grant D856,948 - Vasoya , et al. A	2019-08-20
Circuit board having arrangements of light-emitting diodes Grant D837,171 - Vasoya , et al. J	2019-01-01
Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly Grant 9,883,580 - Vasoya January 30, 2	2018-01-30
Build-up printed wiring board substrate having a core layer that is part of a circuit Grant 9,408,314 - Vasoya August 2, 2	2016-08-02
Processes for manufacturing printed wiring boards Grant RE45,637 - Vasoya July 28, 2	2015-07-28
Build-up Printed Wiring Board Substrate Having A Core Layer That Is Part Of A Circuit App 20120241202 - Vasoya; Kalu K.	2012-09-27
Build-up printed wiring board substrate having a core layer that is part of a circuit Grant 8,203,080 - Vasoya June 19, 2	2012-06-19
Lightweight Circuit Board With Conductive Constraining Cores App 20120097431 - Vasoya; Kalu K. ; et al.	2012-04-26
Lightweight circuit board with conductive constraining cores Grant 8,097,335 - Vasoya , et al. January 17, 2	2012-01-17
Printed Circuit Board with Embossed Hollow Heatsink Pad App 20110272179 - Vasoya; Kalu K.	2011-11-10
Lightweight Circuit Board With Conductive Constraining Cores App 20100319969 - Vasoya; Kalu K. ; et al.	2010-12-23
Processes for manufacturing printed wiring boards Grant 7,730,613 - Vasoya June 8, 2	2010-06-08
Lightweight circuit board with conductive constraining cores Grant 7,667,142 - Vasoya , et al. February 23, 2	2010-02-23
Lightweight circuit board with conductive constraining cores Grant 7,635,815 - Vasoya , et al. December 22, 2	2009-12-22
Printed Wiring Board With Conductive Constraining Core Including Resin Filled Channels App 20090090465 - Vasoya; Kalu K.	2009-04-09
Build-up printed wiring board substrate having a core layer that is part of a circuit App 20080011507 - Vasoya; Kalu K.	2008-01-17
Printed wiring boards possessing regions with different coefficients of thermal expansion Grant 7,301,105 - Vasoya November 27, 2	2007-11-27
Processes For Manufacturing Printed Wiring Boards Possessing Electrically Conductive Constraining Cores App 20070215381 - Vasoya; Kalu K.	2007-09-20
Expansion constrained die stack Grant 7,173,325 - Vasoya , et al. February 6, 2	2007-02-06
Manufacturing process: how to construct constraining core material into printed wiring board App 20060231198 - Vasoya; Kalu K.	2006-10-19
Edge plated printed wiring boards App 20060104035 - Vasoya; Kalu K. ; et al.	2006-05-18
Printed wiring boards possessing regions with different coefficients of thermal expansion App 20060063428 - Vasoya; Kalu K.	2006-03-23
Lightweight circuit board with conductive constraining cores Grant 6,869,664 - Vasoya , et al. March 22, 2	2005-03-22
Expansion constrained die stack App 20050056922 - Vasoya, Kalu K. ; et al.	2005-03-17
Lightweight circuit board with conductive constraining cores App 20050019541 - Vasoya, Kalu K. ; et al.	2005-01-27
Lightweight circuit board with conductive constraining cores App 20050019535 - Vasoya, Kalu K. ; et al.	2005-01-27
Lightweight circuit board with conductive constraining cores App 20020157859 - Vasoya, Kalu K. ; et al.	2002-10-31

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