| Patent | Date |
|---|
Region Shielding Within A Package Of A Microelectronic Device
App 20220139846 - Variot; Patrick ; et al. | 2022-05-05 |
3d-Interconnect
App 20210366857 - Chia; Chok J. ; et al. | 2021-11-25 |
3D-interconnect
Grant 11,031,362 - Chia , et al. June 8, 2 | 2021-06-08 |
3D-Interconnect
App 20190148324 - Chia; Chok J. ; et al. | 2019-05-16 |
3D-interconnect
Grant 10,181,447 - Chia , et al. Ja | 2019-01-15 |
3d-interconnect
App 20180308813 - Chia; Chok J. ; et al. | 2018-10-25 |
Electronic device package and method of manufacture
Grant 8,384,205 - Low , et al. February 26, 2 | 2013-02-26 |
Flip-chip Package And Method Of Manufacturing The Same Using Ablation
App 20120018901 - Variot; Patrick ; et al. | 2012-01-26 |
Electronic Device Package And Method Of Manufacture
App 20110260324 - Low; Qwai ; et al. | 2011-10-27 |
Electronic device package and method of manufacture
Grant 7,993,981 - Low , et al. August 9, 2 | 2011-08-09 |
Electronic Device Package And Method Of Manufacture
App 20100314747 - Low; Qwai ; et al. | 2010-12-16 |
Bondable anodized aluminum heatspreader for semiconductor packages
Grant 6,297,550 - Chia , et al. October 2, 2 | 2001-10-02 |
Method for planarizing an array of solder balls
Grant 6,088,914 - Variot , et al. July 18, 2 | 2000-07-18 |
Method for compensating for bottom warpage of a BGA integrated circuit
Grant 5,989,937 - Variot , et al. November 23, 1 | 1999-11-23 |
Process for using a removeable plating bus layer for high density substrates
Grant 5,981,311 - Chia , et al. November 9, 1 | 1999-11-09 |
Method of providing electrical connection between an integrated circuit die and a printed circuit board
Grant 5,933,710 - Chia , et al. August 3, 1 | 1999-08-03 |
Ball grid array package employing solid core solder balls
Grant 5,841,198 - Chia , et al. November 24, 1 | 1998-11-24 |
Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage
Grant 5,745,986 - Variot , et al. May 5, 1 | 1998-05-05 |
Method for encapsulating an integrated circuit package
Grant 5,692,296 - Variot December 2, 1 | 1997-12-02 |
Apparatus for encapsulating an integrated circuit package
Grant 5,570,272 - Variot October 29, 1 | 1996-10-29 |
Surface mount peripheral leaded and ball grid array package
Grant 5,563,446 - Chia , et al. October 8, 1 | 1996-10-08 |
Overmolded semiconductor package
Grant 5,557,150 - Variot , et al. September 17, 1 | 1996-09-17 |
Integrated circuit having a coplanar solder ball contact array
Grant 5,435,482 - Variot , et al. July 25, 1 | 1995-07-25 |
GPT system for encapsulating an integrated circuit package
Grant 5,420,752 - Variot May 30, 1 | 1995-05-30 |
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